Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
View Patent ↗A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.
1. A semiconductor chip thermal management system, comprising:
a chamber;
an optical receiver housed in said chamber;
at least one spray head situated in said chamber to provide liquid spray onto said semiconductor chip;
a liquid temperature conditioning system;
a fluid displacement mechanism;
injection piping providing cooling liquid to said spray head from said temperature conditioning system, via said fluid displacement mechanism.
2. The semiconductor chip thermal management system of claim 1 , further comprising a return piping delivering cooling liquid collected from the cooling chamber to said liquid temperature conditioning system.
3. The semiconductor chip thermal management system of claim 1 , further comprising a seal provided on said cooling chamber.
4. The semiconductor chip thermal management system of claim 1 , further comprising a pressure sensing device indicating the pressure inside the cooling chamber.
5. The semiconductor chip thermal management system of claim 1 , further comprising a temperature sensor indicating the temperature inside said cooling chamber.
6. The semiconductor chip thermal management system of claim 1 , further comprising a cooling head situated inside said cooling chamber and wherein said spray head is provided on said cooling head.
7. The semiconductor chip thermal management system of claim 6 , wherein said at least one spray head comprises at least one array of spray heads provided on said cooling head.
8. The semiconductor chip thermal management system of claim 1 , wherein said cooling chamber comprises means for accommodating an objective lens housing therein.
9. The semiconductor chip thermal management system of claim 1 , wherein said liquid temperature conditioning system is a chiller.
10. The semiconductor chip thermal management system of claim 1 , wherein said fluid displacement mechanism is a mechanical pump.
11. An integrated circuit (IC) thermal management system for use with an IC tester stimulating said IC, comprising:
a cooling chamber having one side thereof exposed to said IC;
a seal provided on said cooling chamber on the side exposed to said IC;
an optical receiver situated in said cooling chamber;
at least one spray head situated in said cooling chamber to provide coolant liquid spray onto said IC;
a liquid temperature conditioning system;
a fluid displacement mechanism;
injection piping providing cooling liquid to said spray head from said temperature conditioning system, via said fluid displacement mechanism; and,
return piping delivering coolant liquid collected from the cooling chamber to said liquid temperature conditioning system.
12. The IC thermal management system of claim 11 , further comprising control instrumentation receiving pressure and temperature signals and controlling operation of said IC thermal management system according to values of said signals.
13. The IC thermal management system of claim 12 , further comprising a pressure transducer and a temperature sensor producing said pressure and temperature signals.
14. An integrated (IC) thermal management system for use with an IC tester stimulating IC, comprising:
a cooling chamber having one side thereof exposed to said IC;
a seal provided on seid cooling chamber on the side exposed to said IC;
at least one sprey situated in said cooling chamber to provide coolant liquid spray onto said IC;
a liquid temperature conditioning system;
a fluid displacement mechanism;
injection piping providing cooling liquid to said spray head from said temperature conditioning system, via said fluid displacement mechanism; return piping delivering coolant liquid collected the cooling chamber to said liquid temperature conditioning system;
a control instrumentation receiving pressure and temperature signals and controlling operation of seid IC thermal management system according to values of said signals; and
a solenoid valve and wherein said pressure signal comprises a cooling spray signal and chamber pressure signal, and wherein said control instrumentation controls operating speed of said pump according to said cooling spray signal, and controls operation of said solenoid valve according to said chamber pressure signal.
15. The semiconductor chip thermal management system of claim 11 , wherein said liquid temperature conditioning system is a chiller.
16. The semiconductor chip thermal management system of claim 11 , wherein said fluid displacement mechanism is a mechanical pump.
17. The IC thermal management system of claim 11 , further comprising a seal plate configured to support said IC and form a seal in cooperation with said seal.
18. The IC thermal management system of claim 14 , wherein said seal plate further comprises coolant fluid channels providing coolant fluid passage to said IC.
19. An integrated circuit (IC) thermal management system for use with an IC tester having an optical receiver, comprising:
a cooling chamber housing said optical receiver and having one side thereof exposed to said IC;
a seal provided on said cooling chamber on the side exposed to said IC;
at least one spray head situated in said cooling chamber to provide coolant liquid spray onto said IC;
a liquid temperature conditioning system;
a fluid displacement mechanism;
injection piping providing cooling liquid to said spray head from said temperature conditioning system, via said fluid displacement mechanism.
20. The IC thermal management system of claim 19 , further comprising a return piping delivering coolant liquid collected from the cooling chamber to said temperature conditioning system.
21. The IC thermal management system of claim 19 , further comprising means for preventing said liquid spray from interfering with optimal operation of said optical receiver.
22. The IC thermal management system of claim 21 , wherein said means comprises a shield.
23. The IC thermal management system of claim 21 , wherein said means comprises a solid immersion lens.
24. The IC thermal management system of claim 19 , wherein said optical receiver comprises an objective lens housing situated inside said cooling chamber.
25. The semiconductor chip thermal management system of claim 19 , wherein said liquid temperature conditioning system is a chiller.
26. The semiconductor chip thermal management system of claim 25 , wherein said fluid displacement mechanism is a mechanical pump.
27. The IC thermal management system of claim 24 , further comprising a solid objective lens situated at a tip of said objective lens housing.
28. The semiconductor chip thermal management system of claim 9 , wherein said chiller comprises a sealed reservoir.
29. A semiconductor chip thermal management system, comprising:
a chamber;
at least one spray head situated in said chamber to provide liquid spray onto said semiconductor chip;
a liquid temperature conditioning system;
a fluid displacement mechanism;
injection piping providing cooling liquid to said spray head from said temperature conditioning system, via said fluid displacement mechanism; and,
a transparent cooling plate covering said semiconductor chip.
30. The semiconductor chip thermal management system of claim 1 , wherein said optical receiver comprises an objective lens.
31. The semiconductor chip thermal management system of claim 1 , wherein said optical receiver comprises a solid immersion lens.
32. The semiconductor chip thermal management system of claim 11 , wherein said optical receiver comprises an objective lens.
33. The semiconductor chip thermal management system of claim 11 , wherein said optical receiver comprises a solid immersion lens.