Patent Assignment
Reel/Frame 019733/0853
SECURITY AGREEMENT
Recorded: 2007-08-24
Received: 2007-08-24
Pages: 13
Assignor
ISOTHERMAL SYSTEMS RESEARCH, INC.
Executed: 2007-08-16
Assignee
SILICON VALLEY BANK
3003 TASMAN DRIVE, SANTA CLARA, CA, 95054, UNITED STATES
Covered Applications
(34)
WEAPONS AND WEAPON COMPONENTS INCORPORATING REACTIVE MATERIALS
App. No. 11/512,058
→
TRANSCEIVER MODULE
App. No. 11/437,676
→
METHOD OF OPERATING A THERMAL MANAGEMENT SYSTEM
App. No. 11/255,457
→
LOW MOMENTUM LOSS FLUID MANIFOLD SYSTEM
App. No. 11/115,601
→
SPRAY COOLING SYSTEM
App. No. 10/955,323
→
SPRAY COOLING SYSTEM FOR TRANSVERSE THIN-FILM EVAPORATIVE SPRAY COOLING
App. No. 10/913,299
→
ETCHED OPEN MICROCHANNEL SPRAY COOLING
App. No. 10/786,451
→
HOTSPOT COLDPLATE SPRAY COOLING SYSTEM
App. No. 10/786,243
→
INPUT/OUTPUT TRANSITION BOARD SYSTEM
App. No. 10/783,397
→
THREE DIMENSIONAL PACKAGING AND COOLING OF MIXED SIGNAL, MIXED POWER DENSITY ELECTRONIC MODULES
App. No. 10/769,543
→
DYNAMIC THERMAL MANAGEMENT SPRAY SYSTEM
App. No. 10/769,561
→
SPINDLE-MOTOR DRIVEN PUMP SYSTEM
App. No. 10/769,037
→
LOW MOMENTUM LOSS FLUID MANIFOLD SYSTEM
App. No. 10/769,259
→
STAGGERED SPRAY NOZZLE SYSTEM
App. No. 10/723,608
→
METHOD OF CONTROLLING SPRAY DISTANCES IN A SPRAY UNIT
App. No. 10/723,607
→
POWER SEMICONDUCTOR SWITCHING DEVICES, POWER CONVERTERS, INTEGRATED CIRCUIT ASSEMBLIES, INTEGRATED CIRCUITRY, POWER CURRENT SWITCHING METHODS, METHODS OF FORMING A POWER SEMICONDUCTOR SWITCHING DEVICE, POWER CONVERSION METHODS, POWER SEMICONDUCTOR SWITCHING DEVICE
App. No. 10/703,921
→
LIQUID THERMAL MANAGEMENT SOCKET SYSTEM
App. No. 10/693,671
→
SPRAY COOL SYSTEM WITH A DRY ACCESS CHAMBER
App. No. 10/649,328
→
SPRAY COOLANT RESERVOIR SYSTEM
App. No. 10/649,327
→
DRY-WET THERMAL MANAGEMENT SYSTEM
App. No. 10/648,774
→
SEALED SPRAY COOLING SYSTEM
App. No. 10/406,785
→
SPRAY COOLING AND TRANSPARENT COOLING PLATE THERMAL MANAGEMENT SYSTEM
App. No. 10/379,925
→
COOLANT RECOVERY SYSTEM
App. No. 10/371,403
→
SPRAY COOLING SYSTEM FOR EXTREME ENVIRONMENTS
App. No. 10/369,321
→
SPRAY COOLING SYSTEM
App. No. 10/368,289
→
INTEGRATED CIRCUIT HEAT DISSIPATION SYSTEM
App. No. 10/292,073
→
DYNAMIC SPRAY SYSTEM
App. No. 10/280,240
→
SEMICONDUCTOR BURN-IN THERMAL MANAGEMENT SYSTEM
App. No. 10/243,683
→
SPRAY COOLING THERMAL MANAGEMENT SYSTEM AND METHOD FOR SEMICONDUCTOR PROBING, DIAGNOSTICS, AND FAILURE ANALYSIS
App. No. 10/222,107
→
METHOD AND APPARATUS FOR COOLING ELECTRONIC COMPONENTS
App. No. 10/118,279
→
SPRAY COOLING SYSTEM FOR TRANSVERSE THIN-FILM EVAPORATIVE SPRAY COOLING
App. No. 10/096,340
→
POWER SEMICONDUCTOR SWITCHING DEVICES, POWER CONVERTERS, INTEGRATED CIRCUIT ASSEMBLIES, INTEGRATED CIRCUITRY, POWER CURRENT SWITCHING METHODS, METHODS OF FORMING A POWER SEMICONDUCTOR SWITCHING DEVICE, POWER CONVERSION METHODS, POWER SEMICONDUCTOR SWITCHING DEVICE
App. No. 09/904,575
→
POWER SEMICONDUCTOR SWITCHING DEVICES, POWER CONVERTERS, INTEGRATED CIRCUIT ASSEMBLIES, INTEGRATED CIRCUITRY, POWER CURRENT SWITCHING METHODS, METHODS OF FORMING A POWER SEMICONDUCTOR SWITCHING DEVICE, POWER CONVERSION METHODS, POWER SEMICONDUCTOR SWITCHING DEVICE
App. No. 09/904,578
→
SPRAY EVAPORATIVE COOLING SYSTEM AND METHOD
App. No. 09/860,038
→