Sealed spray cooling system
View Patent ↗A sealed spray cooling system for reducing coolant loss within thermal management systems. The sealed spray cooling system includes a spray housing defining a spray chamber having at least one atomizer and a seal member attached to the spray housing about the spray chamber for sealing against a semiconductor forming a sealed spray area. Alternatively, the spray unit is comprised of a first member, a second member having at least one atomizer, the second member pivotally attached to the first member forming an interior cavity between thereof, and a seal member attached to the second member for sealing against a semiconductor within the first member thereby forming a sealed spray area. A vacuum manifold is preferably fluidly connected to the spray cavity thereby reducing the pressure within the spray cavity.
1. A spray unit for a thermal management system, comprising:
a base member for receiving and electrically communicating with at least one semiconductor;
a cover member having at least one atomizer, said cover member pivotally attached to said base member forming an interior cavity between thereof; and
a seal member attached to said cover member for sealing against a sealing surface thereby forming a sealed spray area.
2. The spray unit for a thermal management system of claim 1 , wherein said sealing surface is comprised of a surface of a semiconductor.
3. The spray unit for a thermal management system of claim 1 , wherein said sealing surface is comprised of a socket.
4. The spray unit for a thermal management system of claim 1 , wherein said sealing surface is comprised of an integrated heat sink.
5. The spray unit for a thermal management system of claim 1 , wherein said sealing surface is comprised of a circuit board.
6. The spray unit for a thermal management system of claim 1 , wherein said seal member is comprised of a resilient material.
7. The spray unit for a thermal management system of claim 1 , wherein said seal member is comprised of an O-ring.
8. The spray unit for a thermal management system of claim 1 , including a latch structure for securing said second member to said first member in a closed relationship.
9. The spray unit for a thermal management system of claim 1 , including a vacuum unit fluidly connected to said spray chamber.
10. The spray unit for a thermal management system of claim 1 , including a thermal management unit fluidly connected to said spray unit.
11. The spray unit for a thermal management system of claim 1 , wherein said first member is comprised of a socket.
12. The spray unit for a thermal management system of claim 11 , wherein said first member is a component of a burn-in board.
13. A spray unit for a thermal management system, comprising:
a first member formed for receiving at least one semiconductor;
a second member having at least one atomizer, said second member-pivotally attached to said first member forming an interior cavity between thereof; and
a seal member attached to said second member for sealing against a surface of a semiconductor thereby forming a sealed spray area.
14. The spray unit for a thermal management system of claim 13 , wherein said seal member is comprised of a resilient material.
15. The spray unit for a thermal management system of claim 13 , including a latch structure for securing said second member to said first member in a closed relationship.
16. The spray unit for a thermal management system of claim 13 , wherein said first member is comprised of a socket.
17. A spray unit for a thermal management system, comprising:
a first member formed for receiving at least one semiconductor;
a second member having at least one atomizer, said second member pivotally attached to said first member forming an interior cavity between thereof; and
a seal member attached to said second member for sealing against a surface of an integrated heat sink thereby forming a sealed spray area.
18. The spray unit for a thermal management system of claim 17 , wherein said seal member is comprised of a resilient material.
19. The spray unit for a thermal management system of claim 17 , including a latch structure for securing said second member to said first member in a closed relationship.
20. The spray unit for a thermal management system of claim 17 , wherein said first member is comprised of a socket.