Patent Assignment
Reel/Frame 024294/0473
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2010-04-27
Received: 2010-04-27
Pages: 13
Assignor
ISOTHERMAL SYSTEMS RESEARCH, INC.
Executed: 2010-03-01
Assignee
PARKER INTANGIBLES LLC
6035 PARKLAND BLVD, CLEVELAND, OH, 44124, UNITED STATES
Covered Applications
(69)
NARROW GAP SPRAY COOLING IN A GLOBALLY COOLED ENCLOSURE
App. No. 12/541,315
→
SPRAY COOLED MOTOR SYSTEM
App. No. 12/156,967
→
PASSIVE FLUID RECOVERY SYSTEM
App. No. 11/944,244
→
DUAL SIDED BOARD THERMAL MANAGEMENT SYSTEM
App. No. 11/618,566
→
LIQUID THERMAL MANAGEMENT PURGING SYSTEM
App. No. 11/617,607
→
ELECTRONICS EQUIPMENT HEAT EXCHANGER SYSTEM
App. No. 11/614,483
→
METHOD OF REDUCING FLUID EMISSIONS FROM A GLOBAL SPRAY COOLING SYSTEM
App. No. 11/641,509
→
SERVICE TRAY FOR A THERMAL MANAGEMENT SYSTEM
App. No. 11/564,179
→
SPRAY COOL MEANS FOR COOLING A MODULAR INVERTER ELECTRIC MOTOR SYSTEM
App. No. 11/603,796
→
DRY-WET THERMAL MANAGEMENT SYSTEM
App. No. 11/560,672
→
SYSTEMS AND METHODS FOR ELECTRICAL LEAKAGE DETECTION
App. No. 11/589,831
→
LOCALIZED THERMAL MANAGEMENT SYSTEM
App. No. 11/553,867
→
SERVER FARM LIQUID THERMAL MANAGEMENT SYSTEM
App. No. 11/550,790
→
COMBINATION SPRAY AND COLD PLATE THERMAL MANAGEMENT SYSTEM
App. No. 11/532,421
→
METHOD OF OPERATING A SPRAY UNIT
App. No. 11/356,272
→
THREE DIMENSIONAL PACKAGING AND COOLING OF MIXED SIGNAL, MIXED POWER DENSITY ELECTRONIC MODULES
App. No. 11/351,660
→
NARROW GAP SPRAY COOLING IN A GLOBALLY COOLED ENCLOSURE
App. No. 11/347,898
→
GLOBALLY COOLED COMPUTER SYSTEM
App. No. 11/334,269
→
HEAT EXCHANGER SYSTEM
App. No. 11/327,181
→
INSULATED SPRAY COOLING SYSTEM FOR EXTREME ENVIRONMENTS
App. No. 11/303,864
→
ENCLOSED CONTAINER LID OPENING/CLOSING SYSTEM AND ENCLOSED CONTAINER LID OPENING/CLOSING METHOD
App. No. 11/257,307
→
METHOD OF OPERATING A THERMAL MANAGEMENT SYSTEM
App. No. 11/255,457
→
SPRAY COOLING SYSTEM FOR EXTREME ENVIRONMENTS
App. No. 11/255,456
→
SPRAY COOLING SYSTEM FOR TRANSVERSE THIN-FILM EVAPORATIVE SPRAY COOLING
App. No. 11/241,487
→
SPRAY COOLING SYSTEM FOR NARROW GAP TRANSVERSE EVAPORATIVE SPRAY COOLING
App. No. 11/221,367
→
INJECTION MOLDING APPARATUS FOR PRODUCING AN ATOMIZER
App. No. 11/188,580
→
METHODS AND APPARATUS FOR ATOMIZATION OF A LIQUID
App. No. 11/188,569
→
AZEOTROPE SPRAY COOLING SYSTEM
App. No. 11/183,333
→
DYNAMIC SPRAY SYSTEM
App. No. 11/142,893
→
DYNAMIC SPRAY SYSTEM
App. No. 11/142,902
→
STAGGERED SPRAY NOZZLE SYSTEM
App. No. 11/137,137
→
LOW MOMENTUM LOSS FLUID MANIFOLD SYSTEM
App. No. 11/115,601
→
DIAMOND FOAM SPRAY COOLING SYSTEM
App. No. 11/046,657
→
HYBRID THERMAL MANAGEMENT SYSTEM
App. No. 11/036,972
→
SPRAY COOLING SYSTEM
App. No. 10/955,323
→
SPRAY COOLING SYSTEM FOR TRANSVERSE THIN-FILM EVAPORATIVE SPRAY COOLING
App. No. 10/913,299
→
ATOMIZER FOR THERMAL MANAGEMENT SYSTEM
App. No. 10/861,333
→
MICROCHANNEL THERMAL MANAGEMENT SYSTEM
App. No. 10/827,993
→
ETCHED OPEN MICROCHANNEL SPRAY COOLING
App. No. 10/786,451
→
HOTSPOT COLDPLATE SPRAY COOLING SYSTEM
App. No. 10/786,243
→
INPUT/OUTPUT TRANSITION BOARD SYSTEM
App. No. 10/783,397
→
THREE DIMENSIONAL PACKAGING AND COOLING OF MIXED SIGNAL, MIXED POWER DENSITY ELECTRONIC MODULES
App. No. 10/769,543
→
DYNAMIC THERMAL MANAGEMENT SPRAY SYSTEM
App. No. 10/769,561
→
SPINDLE-MOTOR DRIVEN PUMP SYSTEM
App. No. 10/769,037
→
LOW MOMENTUM LOSS FLUID MANIFOLD SYSTEM
App. No. 10/769,259
→
NETWORKABLE TELEPHONE SYSTEM
App. No. 10/740,950
→
STAGGERED SPRAY NOZZLE SYSTEM
App. No. 10/723,608
→
METHOD OF CONTROLLING SPRAY DISTANCES IN A SPRAY UNIT
App. No. 10/723,607
→
POWER SEMICONDUCTOR SWITCHING DEVICES, POWER CONVERTERS, INTEGRATED CIRCUIT ASSEMBLIES, INTEGRATED CIRCUITRY, POWER CURRENT SWITCHING METHODS, METHODS OF FORMING A POWER SEMICONDUCTOR SWITCHING DEVICE, POWER CONVERSION METHODS, POWER SEMICONDUCTOR SWITCHING DEVICE
App. No. 10/703,921
→
LIQUID THERMAL MANAGEMENT SOCKET SYSTEM
App. No. 10/693,671
→
System and method for mapping device context to identity context
App. No. 10/673,522
→
SPRAY COOLED MOTOR SYSTEM
App. No. 10/991,003
→
SPRAY COOL SYSTEM WITH A DRY ACCESS CHAMBER
App. No. 10/649,328
→
SPRAY COOLANT RESERVOIR SYSTEM
App. No. 10/649,327
→
DRY-WET THERMAL MANAGEMENT SYSTEM
App. No. 10/648,774
→
SPRAY CHAMBER VALVE CONTROL SYSTEM
App. No. 10/622,181
→
SEALED SPRAY COOLING SYSTEM
App. No. 10/406,785
→
COOLANT RECOVERY SYSTEM
App. No. 10/371,403
→
SPRAY COOLING SYSTEM FOR EXTREME ENVIRONMENTS
App. No. 10/369,321
→
SPRAY COOLING SYSTEM
App. No. 10/368,289
→
INTEGRATED CIRCUIT HEAT DISSIPATION SYSTEM
App. No. 10/292,073
→
ACTUATED ATOMIZER
App. No. 10/281,391
→
DYNAMIC SPRAY SYSTEM
App. No. 10/280,240
→
THERMAL MANAGEMENT SYSTEM FOR EVAPORATIVE SPRAY COOLING
App. No. 10/260,713
→
SEMICONDUCTOR BURN-IN THERMAL MANAGEMENT SYSTEM
App. No. 10/243,683
→
SPRAY COOLING SYSTEM FOR TRANSVERSE THIN-FILM EVAPORATIVE SPRAY COOLING
App. No. 10/096,340
→
POWER SEMICONDUCTOR SWITCHING DEVICES, POWER CONVERTERS, INTEGRATED CIRCUIT ASSEMBLIES, INTEGRATED CIRCUITRY, POWER CURRENT SWITCHING METHODS, METHODS OF FORMING A POWER SEMICONDUCTOR SWITCHING DEVICE, POWER CONVERSION METHODS, POWER SEMICONDUCTOR SWITCHING DEVICE
App. No. 09/904,575
→
POWER SEMICONDUCTOR SWITCHING DEVICES, POWER CONVERTERS, INTEGRATED CIRCUIT ASSEMBLIES, INTEGRATED CIRCUITRY, POWER CURRENT SWITCHING METHODS, METHODS OF FORMING A POWER SEMICONDUCTOR SWITCHING DEVICE, POWER CONVERSION METHODS, POWER SEMICONDUCTOR SWITCHING DEVICE
App. No. 09/904,578
→
CLIENT INSTALLATION AND EXECUTION SYSTEM FOR STREAMED APPLICATIONS
App. No. 09/827,030
→