Microchannel thermal management system
View Patent ↗A microchannel thermal management system for thermally managing a heat producing device. The microchannel thermal management system includes a housing having an interior surface, a cap having a plurality of microchannels attached to the interior surface of the housing, and an inlet port and an outlet port extending through the housing in fluid communication with the microchannels. Alternatively, the microchannels may also extend into the interior surface of the housing. The cap is preferably thermally attached to a heat producing device by a thermal interface layer. Thermally managed coolant enters the inlet port passing through the microchannels conducting heat transferred to the cap by the heat producing device and exits through the outlet port.
1. A thermal management system, comprising:
a substrate;
a housing having an interior surface;
wherein said housing is comprised of a unitary structure;
a cap having a first surface and a second surface;
wherein said first surface and said interior surface are substantially planar;
wherein said first surface of said cap is attached to said interior surface of said housing;
wherein said second surface of said cap is in thermal communication with at least one heat producing device;
a thermal interface layer between said cap and said heat producing device;
wherein said housing is attached to said substrate and wherein said housing surrounds said at least one heat producing device; and
a plurality of microchannels within said interior surface of said housing, wherein said plurality of microchannels are between 20 micrometers to 500 micrometers;
wherein said plurality of microchannels are formed into said interior surface of said housing so as to cover a greater surface area adjacent to at least one hot zone upon said at least one heat producing device.
2. The thermal management system of claim 1 , including at least one inlet port and at least one outlet port extending through said housing in fluid communication with said microchannels.
3. The thermal management system of claim 2 , wherein said at least one inlet port is comprised of a plurality of inlet ports.
4. The thermal management system of claim 2 , wherein said at least one outlet port is comprised of a plurality of outlet ports.
5. The thermal management system of claim 4 , wherein said wherein said at least one inlet port is comprised of a plurality of inlet ports.
6. The thermal management system of claim 2 , wherein said at least one inlet port and said at least one outlet port extend through an inlet opening and an outlet opening within said housing respectively.
7. The thermal management system of claim 1 , including an inlet coupler attached to said inlet port and an outlet coupler attached to said outlet port for removably coupling to a coolant management system.
8. The thermal management system of claim 1 , wherein at least one of said plurality of microchannels is formed into said first surface of said cap.
9. A thermal management system, comprising:
a substrate;
a housing having an interior surface;
wherein said housing is comprised of a unitary structure;
a cap having a first surface and a second surface;
wherein said first surface and said interior surface are substantially planar;
wherein said first surface of said cap is attached to said interior surface of said housing;
wherein said second surface of said cap is in thermal communication with at least one heat producing device;
a thermal interface layer between said cap and said heat producing device;
wherein said housing is attached to said substrate and wherein said housing surrounds said at least one heat producing device;
a plurality of microchannels within said interior surface of said housing, wherein said plurality of microchannels are between 20 micrometers to 500 micrometers;
wherein said plurality of microchannels are formed into said interior surface of said housing so as to cover a greater surface area adjacent to at least one hot zone upon said at least one heat producing device;
at least one inlet port and at least one outlet port extending through said housing in fluid communication with said microchannels;
wherein said at least one inlet port is comprised of a plurality of inlet ports;
wherein said at least one outlet port is comprised of a plurality of outlet ports;
wherein said at least one inlet port and said at least one outlet port extend through an inlet opening and an outlet opening within said housing respectively; and
an inlet coupler attached to said inlet port and an outlet coupler attached to said outlet port for removably coupling to a coolant management system.
10. The thermal management system of claim 9 , wherein at least one of said plurality of microchannels is formed into said first surface of said cap.