Dynamic spray system
View Patent ↗A dynamic spray system for effectively thermally managing electronic components. The dynamic spray system includes one or more spray units each having a housing structure, a first portion, a first orifice within said first portion fluidly connected to a swirl chamber, a main jet fluidly connected to the swirl chamber, a plunger movably positioned within the main jet for adjusting fluid flow through the main jet, and at least one swirl inlet fluidly connected to the swirl chamber for generating a fluid swirl effect within the swirl chamber. The main jet is preferably aligned with the first orifice for dispersing a relatively narrow spray pattern from the first orifice when the fluid flow is increased through the main jet. The spray pattern is broadened when the fluid flow through the main jet is decreased.
1. A method of operating a dynamic spray system, said method comprising the steps of:
providing a spray unit having an orifice, a swirl chamber fluidly connected to said orifice, a main jet fluidly connected to said swirl chamber, a plunger movably positionable within said main jet, and a swirl inlet fluidly connected to said swirl chamber;
positioning a semiconductor in opposition to said spray unit;
dispensing a fluid from said orifice to said semiconductor, wherein said orifice has a spray characteristic dependent upon fluid flow into said swirl chamber from said main jet and said swirl inlet; and
adjusting said spray characteristic to control a temperature A of said semiconductor.
2. The method of operating a dynamic spray system of claim 1 , including the step of (e) increasing a flow rate of said fluid if a temperature A of said semiconductor is above a desired temperature B.
3. The method of operating a dynamic spray system of claim 1 , including the step of (e) decreasing a flow rate of said fluid if a temperature A of said semiconductor is below a desired temperature B.
4. The method of operating a dynamic spray system of claim 1 , wherein said fluid is comprised of a dielectric fluid.
5. The method of operating a dynamic spray system of claim 1 , wherein said fluid is comprised of a non-dielectric fluid.
6. The method of operating a dynamic spray system of claim 1 , wherein if said temperature A is greater than a desired temperature B, said spray pattern is adjusted for increasing the cooling of said semiconductor.
7. The method of operating a dynamic spray system of claim 6 , wherein said spray pattern is increased in size.
8. The method of operating a dynamic spray system of claim 7 , wherein said plunger is extended into said main jet.
9. The method of operating a dynamic spray system of claim 6 , wherein said spray pattern is focused upon a high heat flux area of said semiconductor.
10. The method of operating a dynamic spray system of claim 1 , wherein if said temperature A is less than a desired temperature B, said spray pattern is adjusted for decreasing the cooling of said semiconductor.
11. The method of operating a dynamic spray system of claim 10 , wherein said spray pattern is decreased in size.
12. The method of operating a dynamic spray system of claim 11 , wherein said plunger is partially or fully retracted from said main jet.
13. A dynamic spray system, comprising:
a spray unit having an orifice;
a swirl chamber fluidly connected to said orifice;
a main jet fluidly connected to said swirl chamber;
a plunger movably positionable within said main jet;
an actuator connected to said plunger for manipulating said plunger within said main jet; and
a swirl inlet fluidly connected to said swirl chamber.
14. The dynamic spray system of claim 13 , wherein said main jet is positioned opposite of said orifice.
15. The dynamic spray system of claim 14 , wherein said main jet is aligned with said orifice.
16. The dynamic spray system of claim 13 , wherein said plunger has a tapered portion positionable within said main jet.
17. The dynamic spray system of claim 13 , wherein said swirl inlet extends substantially tangential within said swirl chamber.
18. The dynamic spray system of claim 13 , wherein said swirl chamber has a substantially circular cross sectional interior.
19. The dynamic spray system of claim 13 , wherein said orifice is centrally located with respect to said swirl chamber.
20. The dynamic spray system of claim 13 , including a support plate attached to said plunger, wherein said actuator is connected to said support plate.
21. The dynamic spray system of claim 20 , including a plurality of plungers attached to said support plate that extend into a corresponding plurality of main jets.
22. The dynamic spray system of claim 20 , wherein said actuator is comprised of:
a magnet attached to said support plate; and
a magnetic coil positioned within said spray unit for applying a magnetic force upon said magnet.
23. The dynamic spray system of claim 22 , including at least one spring positioned between said support plate and a main plate, wherein said main plate is non-movably positioned within said spray unit.