IP Library Granted Patent US 6,582,992
Granted Patent Utility
US 6,582,992 · Confirmation No. 9415

STACKABLE SEMICONDUCTOR PACKAGE AND WAFER LEVEL FABRICATION METHOD

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Code Description Pages PDF
2002-08-15 TRNA Transmittal of New Application 2 View
2002-08-15 A.PE Preliminary Amendment 2 View
2002-08-15 SPEC Specification 23 View
2002-08-15 CLM Claims 12 View
2002-08-15 ABST Abstract 1 View
2002-08-15 DRW Drawings-only black and white line drawings 9 View
2002-08-15 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,582,992
App. No.
10/222,294
Filed
2002-08-15
Granted
2003-06-24
Pub. No.
US20030096454A1
Art Unit
2818
PTA
-120 days