Method of applying phase change thermal interface materials
View Patent ↗The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface surface of the heat sink to form an integral interface layer directly on the heat sink during the manufacturing process. This process includes the steps of providing a heat dissipating device having an interface surface, liquefying the phase change material at a controlled temperature so as to decrease the material viscosity to a flowable form, applying the liquefied phase change material directly onto the mating surface of the heat dissipating device either by directly dispensing the material, screen printing or stencil printing and cooling the material causing it to cure on the surface of the heat dissipating device.
1. A method of applying a phase change thermal interface to a contact surface of a heat-dissipating device comprising the following steps in the order listed:
first providing a heat-dissipating device having a contact surface and a thermoplastic polymer phase change material in a solid state;
second heating said solid state phase change material to liquefy said material;
third applying said liquefied phase change material to said contact surface; and
fourth cooling said liquefied phase change material, wherein said cooling allows said liquefied phase change material to return to said solid state, thereby forming a solid fully cured thermal interface layer on said contact surface, wherein said thermal interface layer remains solid throughout the normal operating lifetime of said thermal interface.
2. The method of applying a phase change thermal interface of claim 1 , wherein said step of providing a heat-dissipating device is providing a heat sink.
3. The method of applying a phase change thermal interface of claim 1 , wherein said step of applying said liquefied phase change material further includes screen printing said liquefied phase change material.
4. The method of applying a phase change thermal interface of claim 1 , wherein said step of applying said liquefied phase change material further includes stencil printing said liquefied phase change material.
5. The method of applying a phase change thermal interface of claim 1 , further comprising:
installing said heat dissipating device onto a heat generating electronic component having a heat generating surface, said applied phase change material being in thermal communication with said heat generating surface, after said step of cooling said applied phase change material.