IP Library Assignment 034033/0088
Patent Assignment
Reel/Frame 034033/0088

Assignment of Assignor's Interest

Recorded: 2014-10-22 Pages: 11
Assignor
COOL OPTIONS, INC.
Executed: 2014-10-20
Assignee
TICONA POLYMERS, INC.
8040 DIXIE HIGHWAY, FLORENCE, KENTUCKY, 41042
Covered Properties (65)
Thermally Conductive Composite Material
Patent: 6,048,919 →
Application: 09/239,913 →
Method of Molding a Thermally Conductive Article
Patent: 6,139,783 →
Application: 09/248,798 →
Heat Sink Assembly Manufactured of Thermally Conductive Polymer Material with Insert Molded Metal Attachment Clip
Patent: 6,093,961 →
Application: 09/256,800 →
Process of Molding a Polymer Reinforced with Particles
Patent: 6,261,495 →
Application: 09/375,581 →
Method of molding a reinforced article
Patent: 6,214,263 →
Application: 09/522,552 →
Conductive composite material
Patent: 6,251,978 →
Application: 09/534,409 →
Method of forming a phase change heat sink
Patent: 6,237,223 →
Application: 09/568,748 →
U-Shaped Heat Sink Assembly
Patent: 6,385,047 →
Application: 09/692,555 →
Net-Shape Molded Heat Exchanger
Patent: 6,397,941 →
Application: 09/707,778 →
Thermally Conductive Electronic Device Case
Patent: 6,487,073 →
Application: 09/726,141 →
Publication: US 2002/0064024
Method of Manufacturing an Evenly Colored Thermally Conductive Composite
Patent: 6,407,149 →
Application: 09/726,145 →
Publication: US 2002/0065350
Method of Manufacturing a Heat Pipe Construction
Patent: 6,817,096 →
Application: 09/756,821 →
Publication: US 2001/0047590
Composite Molded Antenna Assembly
Patent: 6,377,219 →
Application: 09/757,720 →
Publication: US 2001/0048397
Injection Molding Apparatus with Bleed Off Pocket for Overmolding Heat Pipes
Patent: 6,540,948 →
Application: 09/757,744 →
Publication: US 2001/0022414
Polymer Composition with Boron Nitride Coated Carbon Flakes
Patent: 6,620,497 →
Application: 09/757,895 →
Publication: US 2001/0048172
Composite Overmolded Heat Pipe Construction
Patent: 6,585,039 →
Application: 09/774,519 →
Publication: US 2003/0102118
Method of Manufacturing a Heat Sink Assembly with Overmolded Carbon Matrix
Patent: 6,680,015 →
Application: 09/774,521 →
Publication: US 2001/0024724
Conforming Heat Sink Assembly
Patent: 6,367,541 →
Application: 09/850,017 →
Publication: US 2001/0047858
Overplated Thermally Conductive Part with Emi Shielding
Patent: 6,543,524 →
Application: 09/886,629 →
Publication: US 2002/0062950
Injection Moldable Elastomeric Gasket
Patent: 6,557,859 →
Application: 09/893,853 →
Publication: US 2002/0014748
Thermally Conductive and High Strength Injection Moldable Composition
Patent: 6,710,109 →
Application: 09/903,347 →
Publication: US 2002/0025998
Thermally Conductive Silk-Screenable Interface Material
Patent: 6,555,486 →
Application: 09/904,050 →
Publication: US 2003/0011066
Highly Thermally Conductive Electronic Connector
Patent: 6,851,869 →
Application: 09/916,056 →
Publication: US 2002/0159235
Nozzle Insert for Long Fiber Compounding
Patent: 6,783,716 →
Application: 09/951,805 →
Publication: US 2002/0041049
Method of Manufacturing a U-Shaped Heat Sink Assembly
Patent: 6,649,108 →
Application: 10/010,600 →
Publication: US 2002/0041487
Method of Making a Capacitor Post with Improved Thermal Conductivity
Patent: 6,620,366 →
Application: 10/026,256 →
Publication: US 2003/0117764
Method of manufacturing a structural frame
Patent: 6,868,602 →
Application: 10/050,384 →
Publication: US 2002/0092160
Flexible Glove-Like Heat Sink
Patent: 6,547,001 →
Application: 10/064,069 →
Publication: US 2002/0185270
Method of Manufacturing a Composite Overmolded Heat Pipe
Patent: 6,681,487 →
Application: 10/123,363 →
Publication: US 2003/0019103
Radial Fin Thermal Transfer Element and Method of Manufacturing Same
Patent: 6,611,660 →
Application: 10/135,743 →
Plunger Molding Machine with Tapered Bore and Thermal Transfer Fins
Patent: 7,037,102 →
Application: 10/213,177 →
Elastomeric Heat Sink with a Pressure Sensitive Adhesive Backing
Patent: 6,886,625 →
Application: 10/222,574 →
Method of Applying Phase Change Thermal Interface Materials
Patent: 7,013,555 →
Application: 10/224,161 →
Publication: US 2003/0041442
Method for Making a Thermally Conductive Article Having an Integrated Surface and Articles Produced Therefrom
Patent: 6,756,005 →
Application: 10/225,632 →
Publication: US 2003/0038393
Self-Heating Food and Beverage Container Made from a Thermally Conductive Polymer Composition
Patent: 6,986,435 →
Application: 10/225,918 →
Publication: US 2003/0038140
Thermally Conductive Elastomeric Pad and Method of Manufacturing Same
Patent: 7,038,009 →
Application: 10/225,924 →
Publication: US 2003/0044631
Thermally Conductive Elastomeric Heat Dissipation Assembly with Snap-in Heat Transfer Conduit
Patent: 6,651,732 →
Application: 10/228,228 →
Publication: US 2003/0042005
Thermally Conductive Lamp Reflector
Patent: 6,827,470 →
Application: 10/229,557 →
Publication: US 2003/0043586
Structure and Method of Attaching a Heat Transfer Part Having a Compressible Interface
Patent: 6,896,045 →
Application: 10/277,948 →
Publication: US 2003/0075312
Print Thermally Conductive Interface Assembly
Patent: 6,803,328 →
Application: 10/287,194 →
Publication: US 2003/0057547
Thermally Conductive Silk-Screenable Interface Material
Patent: 6,635,959 →
Application: 10/287,232 →
Publication: US 2003/0067055
Heat Sink Assembly with Overmolded Carbon Matrix
Patent: 7,311,140 →
Application: 10/288,027 →
Publication: US 2003/0056938
Capacitor Post with Improved Thermal Conductivity
Patent: 6,587,330 →
Application: 10/294,864 →
Publication: US 2003/0117765
Thermally Conductive Drive Belt
Patent: 6,919,115 →
Application: 10/337,538 →
Publication: US 2003/0129350
Light-Emitting Diode Reflector Assembly Having a Heat Pipe
Patent: 6,976,769 →
Application: 10/459,234 →
Publication: US 2004/0252502
Thermally-Conductive Plastic Articles Having Light Reflecting Surfaces
Patent: 7,235,918 →
Application: 10/459,254 →
Publication: US 2004/0251804
Method of Making Thermally-Conductive Casings for Optical Heads in Optical Disc Players
Patent: 6,685,855 →
Application: 10/459,312 →
Method of Forming a Thermally Conductive Article Using Metal Injection Molding Material with High and Low Aspect Ratio Filler
Patent: 6,899,160 →
Application: 10/605,041 →
Publication: US 2004/0104502
Method of Forming a Highly Thermally Conductive and High Strength Article
Patent: 6,835,347 →
Application: 10/605,059 →
Publication: US 2004/0106702
Nozzle Insert for Long Fiber Compounding
Patent: 6,863,729 →
Application: 10/605,145 →
Publication: US 2004/0115292
High-Density, Thermally-Conductive Plastic Compositions for Encapsulating Motors
Patent: 7,077,990 →
Application: 10/607,352 →
Publication: US 2004/0031141
Thermally Conductive Silk-Screenable Interface Material
Patent: 6,828,672 →
Application: 10/767,185 →
Publication: US 2004/0182549
Method of Manufacturing Athermally Conductive Drive Belt
Patent: 7,521,009 →
Application: 10/864,956 →
Publication: US 2004/0222546
Thermally Conductive Elastomeric Pad
Patent: 7,094,822 →
Application: 10/870,629 →
Publication: US 2004/0229035
Plunger Molding Machine with Tapered Bore and Thermal Transfer Fins
Patent: 7,077,642 →
Application: 10/882,629 →
Publication: US 2004/0241279
Molded Electronic Connector Formed from a Thermally Conductive Polymer Composition and Method of Making the Same
Patent: 6,981,805 →
Application: 11/011,996 →
Publication: US 2005/0095901
Method for Making Thermoplastic Thermally-Conductive Interface Articles
Patent: 7,462,309 →
Application: 11/014,613 →
Publication: US 2005/0109766
Polymer Electronic Device Package Having High Thermal Conductivity and Dielectric Strength
Patent: 7,476,702 →
Application: 11/118,057 →
Publication: US 2005/0189523
Thermally Conductive Polymer Compositions Having Low Thermal Expansion Characteristics
Patent: 8,221,885 →
Application: 11/138,118 →
Publication: US 2005/0272845
Thermally Conductive Polymer Compositions Having Moderate Tensile and Flexural Properties
Patent: 7,655,719 →
Application: 11/172,339 →
Publication: US 2006/0014888
In-Mold Metallized Polymer Components and Method of Manufacturing Same
Patent: 7,413,691 →
Application: 11/279,442 →
Publication: US 2006/0234068
Ionic Flow Generator for Thermal Management
Patent: 7,236,344 →
Application: 11/381,571 →
Publication: US 2006/0250746
Molding Method for Forming in-Mold Metallized Polymer Components
Patent: 8,197,730 →
Application: 11/782,061 →
Publication: US 2007/0264513
Thermally Conductive Polymer Compositions Having Low Thermal Expansion Characteristics
Patent: 8,853,313 →
Application: 13/483,467 →
Publication: US 2012/0252951
Thermally Conductive Electronic Device Case
Application: 95/002,328 →
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 16, 2014
From: COOL SHIELD, INC.
To: COOL OPTIONS, INC.
Reel/Frame 033960/0190 →
Assignment of Assignor's Interest Oct 17, 2014
From: MCCULLOUGH, KEVIN A
To: CHIP COOLERS, INC.
Reel/Frame 033972/0450 →
Assignment of Assignor's Interest Oct 17, 2014
From: MCCULLOUGH, KEVIN A.
To: CHIP COOLERS, INC.
Reel/Frame 033972/0629 →
Assignment of Assignor's Interest Oct 17, 2014
From: MCCULLOUGH, KEVIN A.
To: CHIP COOLERS, INC.
Reel/Frame 033972/0745 →
Assignment of Assignor's Interest Oct 21, 2014
From: MCCULLOUGH, KEVIN A.
To: CHIP COOLERS, INC.
Reel/Frame 033993/0905 →
Assignment of Assignor's Interest Nov 18, 2014
From: MCCULLOUGH, KEVIN A.; SAGAL, E. MIKHAIL; MILLER, JAMES D.
To: CHIP COOLERS, INC.
Reel/Frame 034199/0057 →
Release of Security Interest May 19, 2020
From: THE TORONTO-DOMINION BANK
To: GEOTAB INC.
Reel/Frame 052697/0574 →