Method of forming a thermally conductive article using metal injection molding material with high and low aspect ratio filler
View Patent ↗The present invention discloses a conductive injection molding composition. The thermally conductive composition includes a metallic base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. In addition, an alternative embodiment of the composition mixture includes a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.
1. A method of foaming a high thermally conductive article, comprising the steps of:
providing a metallic base matrix of, by volume, between 30 and 60 percent;
providing a first thermally conductive filler, by volume, between 25 and 60 percent; the first thermally conductive filler having an aspect ratio of at learnt 10:1;
providing a second thermally conductive filler, by volume, between 10 and 25 percent; the second thermally conductive filler having an aspect ratio of less than 5:1; and
mixing the first thermally conductive filler, the second thermally conductive filler and the metallic base matrix so that the first thermally conductive filler and the second thermally conductive filler are evenly dispersed throughout the metallic base matrix to form an entirely uniform molding composition;
injection molding the uniform composition into a unitary monolithic thermally conductive article; the first thermally conductive filler and the second thermally conductive filler and the base matrix therein cooperating to reduce the number of thermal interface gaps in said monolithic thermally conductive article.
2. The method of claim 1 , wherein said base matrix is a Metal Injection Molding Material selected from the group consisting of aluminum, copper, brass, alumina and magnesium.
3. The method of claim 1 ,wherein said first thermally conductive filler has particles that are substantially flake-shaped.
4. The method of claim 1 , wherein said first thermally conductive filler has particles that are substantially rice-shaped.
5. The method of claim 1 , wherein said first thermally conductive filler has particles that are substantially strand-shaped.
6. The method of claim 1 , wherein said first thermally conductive filler has particles that are substantially whisker-shaped.
7. The method of claim 1 , wherein said first thermally conductive filter is a material selected from the group consisting of aluminum, alumina, copper, magnesium, brass and carbon.
8. The polymer composition of claim 1 , wherein said second thermally conductive filler material is boron nitride grains.
9. The molding composition of claim 1 , wherein said second thermally conductive filler has particles that are substantially grain shaped.
10. The molding composition of claim 1 , wherein said second thermally conductive filler is a material selected from the group consisting of aluminum, alumina, copper, magnesium, brass, boron nitride and carbon.
11. A method of forming a high thermally conductive article, comprising the steps of:
providing a metallic base matrix of, by volume, between 30 and 60 percent;
providing a first thermally conductive filter, by volume, between 25 and 60 percent; the first thermally conductive filler having an aspect ratio of at least 10:1;
providing a second thermally conductive filter, by volume, between 10 and 25 percent; the second thermally conductive filler having an aspect ratio of less than 5:1; and
mixing the first thermally conductive filler, the second thermally conductive filler and the metallic base matrix so that the first thermally conductive filler end the second thermally conductive filler are evenly dispersed throughout the metallic base matrix to form an entirely uniform molding composition;
casting the uniform composition into a unitary monolithic thermally conductive article; the first thermally conductive filler and the second thermally conductive filler and the base matrix therein cooperating to reduce the number of thermal interface gaps in said monolithic thermally conductive article.
12. The method of claim 11 , wherein said base matrix is a Metal Injection Molding Material selected from the group consisting of aluminum, copper, brass, alumina and magnesium.
13. The method at claim 11 , wherein said first thermally conductive filler has particles that are substantially flake-shaped.
14. The method of claim 11 , wherein said first thermally conductive filler has particles that are substantially rice-shaped.
15. The method of claim 11 , wherein said first thermally conductive filler has particles that are substantially strand-shaped.
16. The method of claim 11 , wherein said first thermally conductive filler has particles that are substantially whisker-shaped.
17. The method of claim 11 , wherein said first thermally conductive filler is a material selected from the group consisting of aluminum, alumina, copper, magnesium, brass and carbon.
18. The polymer composition of claim 11 , wherein said second thermally conductive filler material is boron nitride grains.
19. The molding composition of claim 11 , wherein said second thermally conductive filler has particles that are substantially grain shaped.
20. The molding composition of claim 11 , wherein said second thermally conductive filler is a material selected from the group consisting of aluminum, alumina, copper, magnesium, brass, boron nitride and carbon.