Thermally conductive elastomeric pad and method of manufacturing same
View Patent ↗The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.
1. A method of making a thermally-conductive, elastomeric pad, comprising the steps of:
a) injecting a molten composition into a mold, said composition comprising: i) about 30 to 60by volume of an elastomer polymer matrix, ii) about 25 to about 60by volume of a first thermally conductive filler material having an aspect ratio of 10:1 or greater, and (iii) about 10 to about 15% by volume of a second thermally conductive filler material having an aspect ratio of 5:1 or less;
b) cooling the composition, and
c) removing the composition from the mold.
2. The method of claim 1 , wherein the composition has a thermal conductivity of greater than 3 W/m° K.
3. The method of claim 1 , wherein the elastomer polymer is selected from the group consisting of styrene-butadiene copolymer, polychloroprene, nitrile rubber, butyl rubber, polysulfide rubber, ethylene-propylene terpolymers, polysiloxanes, and polyurethanes.
4. The method of claim 1 , wherein the first and second filler materials are selected from the group consisting of aluminum, alumina, copper, magnesium, brass, carbon, silicon nitride, aluminum nitride, boron nitride, and zinc oxide.
5. The method of claim 1 , wherein the composition comprises: i) about 50 % by volume of the elastomer polymer matrix, ii) about 35 % by volume of the first thermally conductive filler material, and (iii) about 15 % by volume of the second thermally conductive filler material.