Packaged semiconductor with coated leads and method therefore
View Patent ↗A semiconductor die is housed in a package body. Leads, which are electrically coupled to the semiconductor die, extend from the package body and are for connecting to a printed circuit board or other device. The leads are coated with a material that protects the leads from oxidation. The coating is compatible with solder techniques that are commonly used to attach packaged semiconductors to a printed circuit board. In some examples, the coating is removable, after drying, at temperatures below one hundred eighty degrees Celsius. This allows for solder processes, which are typically at least 180° C., to remove the coating thereby exposing the leads, which has been protected from oxidation, so that it can be soldered to the printed circuit board. In some examples, the coating material includes an organic material. In some examples, the coating material is an organic solderability preservative (OSP).
1. A method of making a packaged semiconductor, comprising:
encapsulating a semiconductor die together with a portion of a lead frame;
coating at least leads of the lead frame with a coating that, after drying, is removable from the leads by applying heat at a temperature below one hundred eighty degrees Celsius, wherein the coating includes an organic material; and
electrically testing the semiconductor die;
wherein the coating occurs before the electrical testing;
wherein the leads are formed from a metal material;
in the leads includes coating the leads with no metal material coating located between the coating and the metal material of the leads.
2. The method of claim 1 , wherein the coating comprises dipping the leads in a coating material that, after drying, is removable at temperatures below one hundred eighty degrees.
3. The method of claim 1 , wherein the coating comprises spraying the leads with a coating material that, after drying, is removable at temperatures below one hundred eighty degrees.
4. The method of claim 1 , further comprising:
attaching the packaged semiconductor to a circuit board, the attaching further includes:
soldering the leads to solderable surfaces of the circuit board by applying heat above one hundred eighty degrees Celsius.
5. The method of claim 1 , Further comprising cleaning the leads prior to the coating.
6. The method of claim 1 wherein the lead frame is a portion of a lead frame strip, the lead frame strip including a plurality of die sites, the method further comprising:
singulating the die sites, wherein the coating is performed after the singulating and before the testing.
7. The method of claim 1 wherein the coating includes an organic solderabiliity preservative (OSP).
8. The method of claim 1 wherein the metal material of the leads includes at least one of copper and alloy 42 .
9. A method of making a packaged semiconductor, comprising:
encapsulating a semiconductor die together with a portion of a lead frame;
coating at least leads of the lead frame with a coating that, after drying, is removable from the leads by applying heat at a temperature below one hundred eighty degrees Celsius;
electrically testing the semiconductor die;
wherein the coating is performed prior to the encapsulating;
wherein the coating includes an organic material;
wherein the leads are formed from a metal material;
wherein the coating the leads includes coating the leads with no metal material coating located between the coating and the metal material of the leads.
10. The method of claim 9 , wherein the coating occurs after the electrical testing.
11. The method of claim 9 , wherein the coating occurs before the electrical testing.
12. A method of making a packaged semiconductor, comprising:
encapsulating a semiconductor die together with a portion of a lead frame;
coating at least leads of the lead frame with a coating that, after drying, is removable from the leads at a temperature below one hundred eighty degrees Celsius; and
electrically testing the semiconductor die;
wherein the lead frame is a portion of a lead frame strip, the lead frame strip including a plurality of die sites, the method further comprising:
singulating the die sites, wherein the coating is performed before the singulating.
13. The method of claim 12 wherein:
the coating includes an organic material;
the leads are formed From a metal material;
the coating the leads includes coating the leads with no metal material coating located between the coating and the metal material of the leads.
14. The method of claim 12 wherein:
the coating includes an organic material;
the leads are Loaned from a metal material;
the coating the leads includes coating the leads with no metal material coating located between the coating and the metal material of the leads.
15. A method of making a packaged semiconductor, comprising:
encapsulating a semiconductor die together with a portion of a lead frame;
coating at least loads of the lead frame with a coating that, after drying, is removable from the leads by applying heat at a temperature below one hundred eighty degrees Celsius, wherein the coating includes an organic material; and
wherein the leads are formed from a metal material;
wherein the coating the leads includes coating the leads with no metal material coating located between the coating and the metal material of the leads.
16. The method of claim 15 wherein the lead frame is a portion of a lead frame strip, the lead frame strip including a plurality of die sites, the method further comprising:
singulating the die sites, wherein the coating is performed after the singulating.
17. The method of claim 15 wherein the metal material of the leads includes at least one of copper and alloy 42 .