Compact balun for 802.11a applications
View Patent ↗A balancing/unbalancing (balun) structure includes a microstrip line printed circuit board (PCB). Two input ports are coupled to a differential signal. An isolated port is connected to ground through a resistance. An output port is coupled to a single-ended signal corresponding to the differential signal. A plurality of traces on the PCB connect the two input ports, the load connection port and the output port, wherein distance between adjacent traces is approximately twice PCB thickness.
1. A balancing/unbalancing (balun) structure comprising:
a microstrip printed circuit board (PCB);
a first input port and a second input port for coupling to a differential signal;
an isolated port connected to ground through a resistance;
an output port for coupling to a single-ended signal corresponding to the differential signal; and
a plurality of traces on the PCB connecting the two input ports, the isolated port and the output port, wherein distance between at least two adjacent traces is approximately twice PCB thickness, and
wherein a trace from the first input port to the second input port includes one folded λ/4 element consisting of a single U-shaped trace.
2. The balun structure of claim 1 , wherein the first and second input ports and the output port are on opposite sides of the balun structure.
3. The balun structure of claim 1 , wherein the first and second input ports and the output port are on the same side of the balun structure.
4. The balun structure of claim 1 , wherein the balun structure is a 180° hybrid.
5. The balun structure of claim 1 , wherein the balun structure is approximately square in layout.
6. The balun structure of claim 5 , wherein a transmission distance from a first input port to the output port is λ/4, and wherein a trace from the first input port to the output port includes at least one folded λ/4 element.
7. The balun structure of claim 5 , wherein a transmission distance from a the first input port to the second input port is λ/4.
8. The balun structure of claim 7 , wherein a transmission distance from the second input port to the output port is 3λ/4, and wherein a trace from the second input port to the output port includes at least two folded λ/4 elements.
9. The balun structure of claim 5 , wherein distance between all adjacent traces is approximately twice PCB thickness.
10. The balun structure of claim 5 , wherein the PCB includes two substrate layers, two tracing layers and a ground layer, and
wherein the plurality of traces that comprise the balun are formed on the two tracing layers and are folded over each other.
11. A 180° hybrid balun comprising:
a microstrip line printed circuit board (PCB);
two input ports on one side of the balun for coupling to a differential signal;
an isolated port connected to ground through a resistance;
an output port on an opposite side of the balun for coupling to a single-ended signal corresponding to the differential signal, a direction from the one side to the opposite side defining a horizontal axis; and
a plurality of traces on the PCB connecting the two input ports, the isolated port and the output port,
wherein the plurality of traces includes a plurality of folded λ/4 elements oriented along the horizontal axis, and
wherein one of the folded λ/4 elements connects the two input ports and consists of a single U-shaped trace.
12. The 180° hybrid balun of claim 11 , wherein a transmission distance from a first input port of the two input ports to the output port is λ/4, and wherein a trace from the first input port to the output port includes at least one folded λ/4 element.
13. The 180° hybrid balun of claim 11 , wherein a transmission distance from a first input port of the two input ports to a second input port of the two input ports is λ/4.
14. The 180° hybrid balun of claim 13 , wherein a transmission distance from the second input port to the output port is 3λ/4, and wherein a trace from the second input port to the output port includes at least two folded λ/4 elements.
15. The 180° hybrid balun of claim 11 , wherein distance between adjacent traces is approximately twice PCB thickness.
16. The 180° hybrid balun of claim 11 , wherein the PCB includes two substrate layers, two tracing layers and a ground layer, and wherein the plurality of traces that comprise the balun are formed on the two tracing layers and are folded over each other.
17. The 180° hybrid balun of claim 11 , wherein the 180° hybrid balun is approximately square in layout.