IP Library › Patent Application 10233558
Patent Application Utility
App. No. 10/233,558 · Confirmation No. 9117

Semiconductor package and flip chip bonding method therein

Abandoned -- Failure to Respond to an Office Action View Publication ↗
⬇ PDF
 Code Description Pages PDF
2004-11-17 ABN Abandonment 2 View
2004-05-14 CTRS Requirement for Restriction/Election 5 View
2004-05-14 FWCLM Index of Claims 1 View
2002-09-04 TRNA Transmittal of New Application 2 View
2002-09-04 TRNA Transmittal of New Application 3 View
2002-09-04 A.PE Preliminary Amendment 2 View
2002-09-04 A.PE Preliminary Amendment 2 View
2002-09-04 SPEC Specification 38 View
2002-09-04 SPEC Specification 38 View
2002-09-04 CLM Claims 6 View
2002-09-04 CLM Claims 6 View
2002-09-04 ABST Abstract 1 View
2002-09-04 ABST Abstract 1 View
2002-09-04 DRW Drawings-only black and white line drawings 14 View
2002-09-04 OATH Oath or Declaration filed 5 View
2002-09-04 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2002-09-04 OATH Oath or Declaration filed 5 View
2002-09-04 WFEE Fee Worksheet (SB06) 1 View
2002-09-04 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
2002-09-04 SRFW Search information including classification, databases and other search related notes 1 View
2002-09-04 FWCLM Index of Claims 1 View
2002-09-04 WCLM Claims Worksheet (PTO-2022) 1 View
2002-09-04 DRW Drawings-only black and white line drawings 14 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
10/233,558
Filed
2002-09-04
Pub. No.
US20030001286A1
Art Unit
2822