IP Library › Granted Patent US 6,686,665
Granted Patent Utility
US 6,686,665 · Confirmation No. 3359

SOLDER PAD STRUCTURE FOR LOW TEMPERATURE CO-FIRED CERAMIC PACKAGE AND METHOD FOR MAKING THE SAME

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2015-02-27 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2003-10-03 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-09-02 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2002-12-30 TRNA Transmittal of New Application 3 View
2002-12-30 DRW Drawings-only black and white line drawings 12 View
2002-12-30 LET. Miscellaneous Incoming Letter 1 View
2002-09-04 TRNA Transmittal of New Application 3 View
2002-09-04 SPEC Specification 23 View
2002-09-04 CLM Claims 7 View
2002-09-04 ABST Abstract 1 View
2002-09-04 DRW Drawings-only black and white line drawings 14 View
2002-09-04 OATH Oath or Declaration filed 4 View
2002-09-04 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,686,665
App. No.
10/235,762
Filed
2002-09-04
Granted
2004-02-03
Art Unit
2815
PTA
0 days