Electrical device allowing for increased device densities
View Patent ↗Disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.
1. A device comprising;
a circuit;
a package enclosing said circuit;
a first lead formed from a flexible conductor and an adhesive, said first lead having a first end connected to said circuit, having a portion connected to said package, and having a second end extending from said package and attached to a substrate; and
a spacer positioned between said package and said first lead, said spacer including an adhesive and a resiliently deformable structure in contact with said package and said substrate.
2. The device of claim 1 , further comprising at least a second lead formed from a flexible conductor and an adhesive, said second lead having a first end connected to said circuit, having a portion connected to said package, and having a second end extending from said package.
3. The device of claim 2 , further comprising at least one spacer positioned between said leads.
4. The device of claim 1 , wherein said second end of said first lead is connected to said deformable structure.
5. A device comprising:
a circuit;
a package enclosing said circuit;
a first lead formed from a flexible conductor and an adhesive, said first lead having a first end connected to said circuit, having a portion connected to said package, and having a second end extending from said package and attached to a substrate;
at least a second lead formed from a flexible conductor and an adhesive, said second lead having a first end connected to said circuit, having a portion connected to said package, and having a second end extending from said package and attached to said substrate; and
at least one spacer positioned between said package and at least one of said leads, said spacer including an adhesive and a resiliently deformable structure in contact with said package and said substrate.
6. The device of claim 5 , further comprising at least one spacer positioned between said leads.
7. The device of claim 5 , wherein said second end of said first lead is connected to said deformable structure.
8. A device comprising:
a circuit;
a package enclosing said circuit;
a first lead formed from a flexible conductor and an adhesive, said first lead having a first end connected to said circuit, having a portion connected to said package, and having a second end extending from said package and attached to a substrate;
at least a second lead formed from a flexible conductor and an adhesive, said second lead having a first end connected to said circuit, having a portion connected to said package, and having a second end extending from said package and attached to said substrate; and
at least one spacer positioned between said leads, said spacer including an adhesive and a resiliently deformable structure in contact with said package and said substrate.
9. The device of claim 8 , further comprising at least one spacer positioned between said package and at least one of said leads.
10. The device of claim 8 , wherein said second end of said first lead is connected to said deformable structure.