IP Library › Granted Patent US 7,084,351
Granted Patent B2
US 7,084,351 · App. 10/237,645 · Granted Aug 1, 2006

Electrical device allowing for increased device densities

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Quick Facts
Patent No.
US 7,084,351
App. No.
10/237,645
Granted
Aug 1, 2006
Kind
B2
Abstract

A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.

Claims (36)

1. A circuit board, comprising:

a substrate;

a deformable structure connected to at least a portion of said substrate, wherein at least one substantially continuous portion of said deformable structure is structured to be positioned between said substrate and a first lead and between said substrate and at least a second lead; and

an adhesive structured to be positioned between at least one of said leads and said deformable structure.

2. The circuit board of claim 1 , further comprising a device including a circuit and said first lead, said first lead having a first end connected to said circuit and having a second end connected to said deformable structure.

3. The circuit board of claim 1 , wherein the circuit board includes a plurality of deformable structures connected to said substrate.

4. The circuit board of claim 1 , further comprising a conductor connected to said deformable structure.

5. The circuit board of claim 1 , wherein said substrate includes at least one non-uniform portion.

6. The circuit board of claim 1 , wherein said deformable structure includes a conductor.

7. The circuit board of claim 1 , wherein said deformable structure includes a dielectric.

8. The circuit board of claim 1 , wherein said deformable structure is resilient.

9. A circuit board, comprising:

a substrate;

a deformable structure connected to at least a portion of said substrate, wherein at least one substantially continuous portion of said deformable structure is structured to be positioned between said substrate and a first lead and between said substrate and at least a second lead, wherein said deformable structure is adhesive; and

an adhesive structured to be positioned between at least one of said leads and said deformable structure.

10. The circuit board of claim 9 , further comprising a device including a circuit and said first lead, said first lead having a first end connected to said circuit and having a second end connected to said deformable structure.

11. The circuit board of claim 9 , wherein the circuit board includes a plurality of deformable structures connected to said substrate.

12. The circuit board of claim 9 , further comprising a conductor connected to said deformable structure.

13. The circuit board of claim 9 , wherein said substrate includes at least one non-uniform portion.

14. The circuit board of claim 9 , wherein said deformable structure includes a conductor.

15. The circuit board of claim 9 , wherein said deformable structure includes a dielectric.

16. A circuit board, comprising:

a substrate; and

a deformable structure connected to at least a portion of said substrate, wherein at least one substantially continuous portion of said deformable structure is structured to be positioned between said substrate and a first lead and between said substrate and at least a second lead, wherein said deformable structure is adhesive and wherein said deformable structure is resilient.

17. A circuit board, comprising;

a substrate;

a deformable structure connected to at least a portion of said substrate, wherein at least one substantially continuous portion of said deformable structure is structured to be positioned between said substrate and a first lead and between said substrate and at least a second lead;

a device including a circuit and said first lead, said first lead having a first end connected to said circuit and having a second end connected to said deformable structure; and

at least a second device including a second circuit and said second lead, said second lead having a first end connected to said second circuit and having a second end connected to said deformable structure.

18. The circuit board of claim 17 , wherein said continuous portion of said deformable structure is connected to at least one of said devices.

19. The circuit board of claim 17 , wherein the circuit board includes a plurality of deformable structures connected to said substrate.

20. The circuit board of claim 17 , further comprising a conductor connected to said deformable structure.

21. The circuit board of claim 17 , wherein said substrate includes at least one non-uniform portion.

22. The circuit board of claim 17 , wherein said deformable structure includes a conductor.

23. The circuit board of claim 17 , wherein said deformable structure includes a dielectric.

24. The circuit board of claim 17 , wherein said deformable structure is resilient.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →