IP Library Patent Application 10237657
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App. No. 10/237,657 · Confirmation No. 9516

Method for manufacturing a semiconductor device and a plating apparatus and a sputtering apparatus therefor

Inventor: Kazuyoshi Ueno
Abandoned -- Failure to Respond to an Office Action View Publication ↗
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Code Description Pages PDF
2004-07-08 ABN Abandonment 2 View
2003-12-08 CTNF Non-Final Rejection 7 View
2003-12-08 892 List of references cited by examiner 1 View
2003-12-08 1449 List of References cited by applicant and considered by examiner 1 View
2003-12-08 SRFW Search information including classification, databases and other search related notes 1 View
2003-12-08 FWCLM Index of Claims 1 View
2002-09-10 TRNA Transmittal of New Application 2 View
2002-09-10 ADS Application Data Sheet 3 View
2002-09-10 SPEC Specification 36 View
2002-09-10 CLM Claims 1 View
2002-09-10 ABST Abstract 1 View
2002-09-10 DRW Drawings-only black and white line drawings 9 View
2002-09-10 OATH Oath or Declaration filed 2 View
2002-09-10 WFEE Fee Worksheet (SB06) 1 View
2002-09-10 WFEE Fee Worksheet (SB06) 1 View
2002-09-10 WCLM Claims Worksheet (PTO-2022) 1 View
2002-09-10 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
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Quick Facts
App. No.
10/237,657
Filed
2002-09-10
Pub. No.
US20030010632A1
Art Unit
1753