Assignment of Assignor's Interest

Recorded: 2003-03-25 Received: 2003-03-28 Pages: 3

Assignor

NEC CORPORATION

Executed: 2002-11-01

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN

Covered Properties (17)

Multiple wiring board

Application: 10/303,716 →

Semiconductor device and fabricating method thereof

Application: 10/279,050 →

Semiconductor Device and Method for Manufacturing the Same

Application: 10/271,727 →

Semiconductor Device

Application: 10/265,261 →

Esd Protection Element

Application: 10/259,633 →

Identification of IC chip based on information formed on high-molecular film

Application: 10/252,386 →

Delay Locked Loop

Application: 10/241,515 →

Method for manufacturing a semiconductor device and a plating apparatus and a sputtering apparatus therefor

Application: 10/237,657 →

Lsi Diagnostic System and Method of Diagnosing Lsi

Application: 10/236,951 →

Driver Circuit

Application: 10/235,819 →

Semiconductor Device and Manufacturing Method of the Same

Application: 10/234,379 →

Method of Making a Non-Volatile Semiconductor Memory Device

Application: 10/233,616 →

Semiconductor Memory Device Including Shadow Ram

Application: 10/232,672 →

High Speed Sampling Receiver with Reduced Output Impedance

Application: 10/232,657 →

Semiconductor Integrated Circuit and Its Layout Method

Application: 10/230,197 →

Semiconductor Device Having Smooth Refractory Metal Silicide Layers and Process for Fabrication Thereof

Application: 10/229,144 →

Method for manufacturing semiconductor device capable of expelling argon gas

Application: 10/187,968 →