IP Library Granted Patent US 6,843,833
Granted Patent B2
US 6,843,833 · App. 10/250,229 · Granted Jan 18, 2005

Front opening unified pod and associated method for preventing outgassing pollution

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Quick Facts
Patent No.
US 6,843,833
App. No.
10/250,229
Granted
Jan 18, 2005
Kind
B2
Abstract

A front opening unified pod for preventing the contamination of wafers due to outgassing. The front opening unified pod includes a front opening unified pod body and a cleaning apparatus. The front opening unified pod has an opening section and a base plate within the opening section and the base plate facing each other. The cleaning apparatus has at least an air-blasting element installed inside the front opening of the unified pod body. An air supplying system connected to the air-blasting element provides a stream of air.

Claims (26)

1. A method for preventing outgassing pollution, comprising the steps of:

(a) loading a plurality of wafers into a front opening unified pod, wherein the interior of the front opening unified pod has at least a cleaning apparatus which is capable of producing a jet of air directed towards an opening of the front opening unified pod;

(b) transferring an unprocessed wafer from the front opening unified pod to a reaction chamber through the opening of the front opening unified pod;

(c) processing the unprocessed wafer inside the reaction chamber to produce a processed wafer;

(d) transferring the processed wafer from the reaction chamber to the front opening unified pod;

(e) repeating the steps from (b) to (d) until all the wafers inside the front opening unified pod are processed; and

(f) blowing the jet of air via the cleaning apparatus into the front opening unified pod throughout the period when the steps from (b) to (e) are performed so that the front opening unified pod is purged to remove any possible contaminants that might contaminate the unprocessed wafers.

2. The method of claim 1 , wherein the cleaning apparatus comprises:

at least an air-blasting element set up inside the front opening unified pod; and

an air supplying system connected to the air-blasting element for providing a stream of air to the air-blasting element.

3. The method of claim 2 , wherein the air-blasting element is set up on sidewall of a base plate positioned opposite to the opening of the front opening unified pod.

4. The method of claim 2 , wherein the air-blasting element comprises a filter.

5. The method of claim 2 , wherein the air-blasting element comprises a nozzle.

6. The method of claim 1 , wherein the jet of air comprises an inert gas.

7. The method of claim 1 , wherein the jet of air comprises gaseous nitrogen.

8. The method of claim 1 , wherein in step (f), the jet of air is a laminar flow.

9. A front opening unified pod for preventing outgassing pollution, comprising at least:

a front opening unified pod body having a first opening section and a base plate, wherein the base plate and the opening section face each other; and

a cleaning apparatus, comprising:

at least an air-blasting element set up on the base plate facing the first opening section of the front opening unified pod body; and

an air supplying system connected to the air-blasting element for providing a stream of air to the air-blasting element.

10. The front opening unified pod of claim 9 , wherein the air-blasting element is set up on sidewall of the base plate.

11. The front opening unified pod of claim 9 , wherein the air-blasting element comprises a filter.

12. The front opening unified pod of claim 9 , wherein the air-blasting element comprises a nozzle.

13. The front opening unified pod of claim 9 , wherein the stream of air comprises an inert gas.

14. The front opening unified pod of claim 9 , wherein the stream of air comprises gaseous nitrogen.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0121 →
CHANGE OF NAME Recorded Jun 28, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049629/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2003
From: WU, JUNG-YUAN; HUANG, KUO-HWA
To: POWERCHIP SEMICONDUCTOR CORP.
Reel/Frame 013731/0638 →