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App. No. 10/253,054 · Confirmation No. 6897

Processing of semiconductor components with dense processing fluids and ultrasonic energy

Expressly Abandoned -- During Examination View Publication ↗
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 Code Description Pages PDF
2005-06-08 ABN.EXPRESS Internal document noting that an Express Abandonment request has been processed 2 View
2005-06-03 EABN Letter Express Abandonment of the application 1 View
2005-04-11 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2005-02-01 CTNF Non-Final Rejection 5 View
2005-02-01 FWCLM Index of Claims 1 View
2005-02-01 BIB Bibliographic Data Sheet 1 View
2003-09-22 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2003-09-22 FOR Foreign Reference 21 View
2003-09-22 FOR Foreign Reference 24 View
2003-09-22 FOR Foreign Reference 48 View
2002-09-24 TRNA Transmittal of New Application 3 View
2002-09-24 SPEC Specification 41 View
2002-09-24 CLM Claims 10 View
2002-09-24 ABST Abstract 1 View
2002-09-24 DRW Drawings-only black and white line drawings 4 View
2002-09-24 OATH Oath or Declaration filed 4 View
2002-09-24 136A Authorization for Extension of Time all replies 3 View
2002-09-24 WFEE Fee Worksheet (SB06) 1 View
2002-09-24 WFEE Fee Worksheet (SB06) 1 View
2002-09-24 IDS Information Disclosure Statement (IDS) Form (SB08) 1 View
2002-09-24 FOR Foreign Reference 22 View
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Quick Facts
App. No.
10/253,054
Filed
2002-09-24
Pub. No.
US20040055621A1
Art Unit
1746