IP Library Granted Patent US 6,927,343
Granted Patent B2
US 6,927,343 · App. 10/266,866 · Granted Aug 9, 2005

Contactor for testing miniaturized devices and components

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Quick Facts
Patent No.
US 6,927,343
App. No.
10/266,866
Granted
Aug 9, 2005
Kind
B2
Abstract

A contactor has a film substrate of an insulating material and plural wiring patterns on the substrate. A first end of each wiring pattern extends out from a first edge of the substrate as a first contact terminal and a second end of each wiring pattern extends out from a second edge of the substrate as a second contact terminal, and a part of the contactor located between the first end and second end can be deformed resiliently.

Claims (51)

1. A test assembly, comprising:

a test apparatus;

a contactor for electrically connecting the testing apparatus with a tested object, comprising:

a film substrate of an insulating material;

a plurality of wiring patterns provided on a surface of said substrate;

a first end of each wiring pattern extending out from a first edge of said substrate as a first contact terminal; and

a second end of each wiring pattern extending out from a second edge of said substrate as a second contact terminal,

wherein when the contactor is positioned between the testing apparatus and the tested object, a part of said wiring patterns located between said first edge and second edge is deformed resiliently, so as to generate a contact force between the tested object and one of the first and second ends.

2. A test assembly as claimed in claim 1 , wherein said substrate is formed of a resilient flexible substrate.

3. A test assembly as claimed in claim 1 , wherein said film substrate includes a first substrate part, a second substrate part, and an interval between the first substrate part and the second substrate part, wherein said first contact terminal extends out from said first substrate part, wherein said second contact terminal extends out from said second substrate part, and wherein said wiring patterns between said first substrate part and said second substrate part are resiliently deformed.

4. A test assembly as claimed in claim 3 , wherein a part of said wiring patterns between said first substrate part and said second substrate part is formed to be extended and shrunk in a longitudinal direction of said wiring pattern.

5. A test assembly as claimed in claim 4 , wherein said deformable part has a zigzag shape.

6. A test assembly as claimed in claim 4 , wherein the wiring patterns between said first substrate part and said second substrate part is formed by subjecting to at least one selected from the group consisting of a thermal annealing process, a plating process and an insulating coating process.

7. A test assembly as claimed in claim 4 , wherein the wire between said first substrate part and said second substrate part is formed by subjecting to at least two selected from the group consisting of a thermal annealing process, a plating process and an insulating coating process.

8. A test assembly as claimed in claim 4 , wherein the wire between said first substrate part and said second substrate part is formed by subjecting to a thermal annealing process, a plating process and an insulating coating process.

9. A test assembly as claimed in claim 3 , wherein said second substrate is divided into a plurality of substrate pieces in correspondence to said plurality of wiring patterns, such that each substrate pieces extends in an elongating direction of said wiring pattern.

10. A test assembly as claimed in claim 3 , wherein an elastic body is filled between said first substrate and said second substrate.

11. A test assembly as claimed in claim 1 , wherein said substrate is provided with one or more of creasing lines perpendicular to an elongating direction of said wiring patterns, and wherein said substrate is deflectable along said creasing line.

12. A test assembly as claimed in claim 11 , wherein said substrate is provided with an opening along one of said creasing lines.

13. A test assembly as claimed in claim 1 , wherein said substrate includes at least one opening facilitating deformation of said substrate.

14. A test assembly as claimed in claim 13 , wherein said opening is provided between adjacent wiring patterns.

15. A test assembly as claimed in claim 13 , wherein said opening is provided in a part of said substrate on which said wiring pattern is provided.

16. A test assembly as claimed in claim 1 , wherein said substrate includes a plurality of first substrates and a flexible second substrate interposed between said first substrates.

17. A test assembly as claimed in claim 1 , wherein said first contact terminal makes a contact with a substrate of a testing apparatus and said second contact terminal makes a contact with an object to be tested,

said contactor further comprising a contact terminal guide having guide openings inserted with said second contact terminals.

18. A test assembly as claimed in claim 17 , wherein said guide opening has an oblique surface.

19. A test assembly as claimed in claim 17 , wherein said contactor terminal guide is formed of a material having a thermal expansion coefficient substantially identical with a thermal expansion coefficient of said object.

20. A test assembly as claimed in claim 1 , wherein said wiring patterns on said substrate are provided with a pitch corresponding to a pitch of electrodes of an object to be tested.

21. A test assembly as claimed in claim 1 , wherein said wiring patterns are provided on one side of said substrate, said substrate further carrying a ground conductor layer on an opposite side thereof.

22. A test assembly as claimed in claim 1 , wherein said substrate carries thereon a testing electronic component.

23. A test assembly as claimed in claim 22 , wherein said testing electronic component is an A/D converter convening an analog signal from an object to be tested into a digital signal.

24. A test assembly as claimed in claim 1 , wherein said wirings are provided on said substrate such that a pitch of said first contact terminals is larger than a pitch of said second contact terminals.

25. A test assembly as claimed in claim 1 , wherein said second contact terminals are provided with a plating process.

26. A test assembly as claimed in claim 1 , wherein said second contact terminals have a rough surface as compared with other part of said wiring patterns.

27. A test assembly as claimed in claim 1 , wherein said second contact terminals have a tip end shaped in correspondence to a shape of electrodes of an object to be tested.

28. A contactor, comprising:

a plurality of stacking units stacked with each other,

each of said stacking units comprising a film substrate of an insulating material and a plurality of wiring patterns provided on a surface of said substrate,

in each of said plurality of stacking units, a first end of each wiring pattern extending out from a first edge of said substrate as a first contact terminal,

a second end of each wiring pattern extending out from a second edge of said substrate as a second contact terminal,

wherein a part of said contactor located between said first edge and second edge can be deformed resiliently.

29. A contactor, comprising:

a plurality of stacking units stacked with each other with a plurality of intervening spacers interposed between a stacking unit and an adjacent stacking unit,

said intervening spaces separating said stacking unit and said adjacent stacking unit with a distance corresponding to a width of said intervening spacers,

each of said stacking units comprising a film substrate of an insulating material and a plurality of wiring patterns provided on a surface of said substrate,

in each of said plurality of stacking units, a first end of each wiring pattern extending out from a first edge of said substrate as a first contact terminal,

a second end of each wiring pattern extending out from a second edge of said substrate as a second contact terminal,

wherein a part of said contactor located between said first edge and second edge can be deformed resiliently.

30. A contactor as claimed in claim 29 , wherein said spacers have different widths.

31. A contactor as claimed in claim 30 , wherein said spacers have respective widths such that said substrate of said stacking unit and said substrate of said adjacent stacking unit form an angle therebetween.

32. A contactor as claimed in claim 29 , wherein each substrate of said plurality of stacking units is divided into a plurality of substrate pieces in correspondence to a wiring pattern such that each of said substrate pieces extends in an elongating direction of said wiring pattern.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035507/0923 →
CHANGE OF NAME Recorded Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2002
From: WATANABE, NAOYUKI; MARUYAMA, SHIGEYUKI; TASHIRO, KAZUHIRO; KOIZUMI, DAISUKE; HASHITANI, TAKAFUMI
To: FUJITSU LIMITED
Reel/Frame 013373/0664 →