Electro-optical apparatus
View Patent ↗An electro-optical apparatus constructed according to various inventive principles disclosed herein provides flexibility in the type and arrangement of components. The electro-optical apparatus preferably includes a Printed Circuit Board (PCB). An interface device can be electrically connected to the PCB, and an electro-optical device can be electrically connected to the interface device. A lens is preferably arranged in optical communication with the electro-optical device. Numerous variations in component selection and arrangement are contemplated within the scope of these inventive principles. Various methods for configuring an electro-optical apparatus are also provided.
1. An electro-optical apparatus comprising:
a printed circuit (PCB) having at least one cutout region;
an interface device electrically connected to the PCB;
an electro-optical device electrically connected to the interface device;
a lens arranged in optical communication with the electro-optical device;
wherein the interface device is flip-chip mounted on a backside of the PCB and wherein the interface device is electrically connected to the PCB through solder bumps; and
wherein the electro-optical device is a flip-chip device arranged on a backside of the PCB in optical communication with the lens through an optical device cutout region in the PCB, and wherein the electro-optical device is electrically connected to the PCB through solder bumps.
2. The apparatus according to claim 1 , further comprising a connector array arranged on the PCB, said connector array configured to communicate electrical signals with an external device.
3. The apparatus according to claim 1 , wherein the lens comprises a molded lens array having a lens element arranged to optical communication with an active area of the electro-optical device.
4. The apparatus according to claim 1 , wherein the at least one cutout region comprises a leadframe cutout region, and further comprising a leadframe mounted to the PCB beneath the leadframe cutout region, wherein the interface device is mounted to the leadframe using a die attach material and wherein the interface device is wirebonded to both the PCB and to the electro-optical device.
5. An electro-optical apparatus comprising:
a printed circuit board (PCB) having at least one cutout region;
an interface device electrically connected to the PCB;
an electro-optical device electrically connected to the interface device;
a lens arranged in optical device communication with the electro-optical device; wherein the interface device is flip-chip mounted on a backside of the PCB and wherein the interface device is electrically connected to the PCB through solder bumps; and
wherein the electro-optical device is physically mounted on the interface device using a die attach material, and wherein the electro-optical device is wirebonded to the PCB.
6. The apparatus according to claim 5 , wherein the die attach material is conductive.
7. The apparatus according to claim 5 , further comprising a connector array arranged on the PCB, said connector array configured to communicate electrical signals with an external device.
8. The apparatus according to claim 5 , wherein the lens comprises a molded lens array having a lens element arranged in optical communication with an active area of the electro-optical device.
9. The apparatus according to claim 5 , wherein the at least one cutout region comprises a leadframe cutout region, and further comprising a leadframe mounted to the PCB beneath the leadframe cutout region, wherein the interface device is mounted to the leadframe using a die attach material and wherein the interface device is wirebonded to both the PCB and to the electro-optical device.
10. An electro-optical apparatus comprising:
a printed circuit board (PCB) having at least one cutout region;
an interface device electrically connected to the PCB;
an electro-optical device electrically connected to the interface device;
a lens arranged in optical communication with the electro-optical device; wherein the interface device is flip-chip mounted on a backside of the PCB and wherein the interface device is electrically connected to the PCB through solder bumps; and
wherein the electro-optical device is physically mounted on the interface device using a die attach material, and wherein the electro-optical device is tape automated bonded to the PCB.
11. The apparatus according to claim 10 , wherein the PCB comprises a flexible printed circuit board having a cutout region, wherein the leadframe is a rigid leadframe arranged beneath the cutout region of the PCB.
12. The apparatus according to claim 11 , wherein the electro-optical device is mounted on the leadframe.
13. The apparatus according to claim 10 , wherein the electro-optical device is flip-chip mounted on a backside of the PCB.
14. The apparatus according to claim 10 , wherein the electro-optical device is mounted on the interface device.
15. The apparatus according to claim 10 , further comprising a connector array arranged on the PCB, said connector array configured to communicate electrical signals with an external device.