IP Library › Granted Patent US 6,749,488
Granted Patent Utility
US 6,749,488 · Confirmation No. 5007

CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION FOR POLISHING CONDUCTIVE AND NON-CONDUCTIVE LAYERS ON SEMICONDUCTOR WAFERS

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2022-09-22 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2004-05-03 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-10-09 TRNA Transmittal of New Application 2 View
2002-10-09 SPEC Specification 13 View
2002-10-09 CLM Claims 5 View
2002-10-09 ABST Abstract 1 View
2002-10-09 OATH Oath or Declaration filed 24 View
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Quick Facts
Patent No.
US 6,749,488
App. No.
10/268,254
Filed
2002-10-09
Granted
2004-06-15
Pub. No.
US20030064671A1
Art Unit
3723
PTA
-34 days