Granted Patent B2

US 6,919,222 · App. 10/277,479 · Granted Jul 19, 2005

Abstract

Claims (7)

1. A method of fabricating an apparatus, the method comprising:

fabricating a device chip including circuit elements on a substrate;

enclosing said circuit elements using a cap and a gasket, said cap covering at least a portion of said device chip, and said gasket having treaded surface.

2. The method recited in claim 1 wherein said treaded surface includes tread cavities.

3. The method recited in claim 1 wherein said device chip includes adhesive on which said gasket is attached.

4. The method recited in claim 1 wherein said cap is cold-welded onto said device chip with gold.

5. The method recited in claim 1 wherein said cap and said gasket hermetically seals said circuit elements.

Assignments (13)