Electrodeposited copper foil for PCB having barrier layer of Zn-Co-As alloy and surface treatment method of the copper foil
View Patent ↗An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising a barrier layer of ternary alloy of Zn—Co—As formed on the copper foil, is provided. Further, a surface treatment method of an electrodeposited copper foil for a printed circuit board, comprising electrolytically treating the copper foil in an electrolytic solution containing pyrophosphoric acid potassium of about 10 g/l to about 200 g/l, Zn of about 0.1 g/l to about 20 g/l, Co of about 0.1 g/l to about 20 g/l and As of about 0.05 g/l to about 5 g/l, is provided. Further, the electrolytic solution remains at the temperature of about 20° C. to about 50° C. and a pH of about 9 to about 13. The copper foil is electrolytically treated for about 2 seconds to about 20 seconds at a cathode current density of about 0.5 A/dm 2 to about 20 A/dm 2 .
1. An electrodeposited copper foil to be laminated on an insulation substrate for a printed circuit board, comprising:
a barrier layer comprising a ternary alloy of Zn—Co—As formed on the copper foil.
2. The electrodeposited copper foil according to claim 1 , wherein a thickness of the barrier layer is about 0.01 μm to about 0.2 μm.
3. A surface treatment method of an electrodeposited copper foil for a printed circuit board, comprising:
electrolytically treating the copper foil in an electrolytic solution comprising pyrophosphoric acid potassium, Zn, Co, and As; and
forming a barrier layer comprising ternary alloy of Zn—Co—As on the copper foil.
4. The surface treatment method of an electrodeposited copper foil according to claim 3 , wherein a concentration of Zn, Co and As in the electrolytic solution is about 0.1 g/l to about 20 g/l, about 0.1 g/l to about 20 g/l and about 0.05 g/l to about 5 g/l, respectively.
5. The surface treatment method of an electrodeposited copper foil according to claim 3 , wherein the electrolytic solution remains at a temperature of about 20° C. to about 50° C.
6. The surface treatment method of an electrodeposited copper foil according to claim 3 , wherein the copper foil is electrolytically treated for about 2 seconds to about 20 seconds at a cathode current density of about 0.5 A/dm 2 to about 20 A/dm 2 .
7. The surface treatment method of an electrodeposited copper foil according to claim 3 , wherein the forming the barrier layer comprises forming the barrier layer having a thickness of about 0.01 μm to about 0.2 μm.
8. The surface treatment of an electrodeposited copper foil according to claim 3 , wherein a concentration of the pyrophosphoric acid potassium is about 10 g/l to about 200 g/l.
9. The surface treatment method of an electrodeposited copper foil according to claim 3 , wherein the electrolytic solution remains at a pH of about 9 to about 13.