IP Library Assignment 021658/0890
Patent Assignment
Reel/Frame 021658/0890

Assignment of Assignor's Interest

Recorded: 2008-10-10 Pages: 6
Assignor
LS CORP.
Executed: 2008-08-08
Assignee
LS MTRON LTD.
#1026-6 HOGYE-DONG, DONG-AN-GU, ANYANG-CITY, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties (57)
Stepless Speed Changing Device
Patent: 5,707,311 →
Application: 08/650,924 →
Three Mode Stepless Speed Changing Device
Patent: 5,803,860 →
Application: 08/731,869 →
Method of Automatically Adjusting a Body of a Tractor to a Horizontal Position and Apparatus for Performing the Same
Patent: 6,131,919 →
Application: 09/344,199 →
Surface Treatment Method of Copper Foil with Silane Coupling Agent
Patent: 6,878,261 →
Application: 10/278,644 →
Publication: US 2003/0111351
Electrodeposited Copper Foil for Pcb Having Barrier Layer of Zn-Co-as Alloy and Surface Treatment Method of the Copper Foil
Patent: 6,893,738 →
Application: 10/278,645 →
Publication: US 2003/0121789
Apparatus for Reversing Lead Frame
Patent: 6,703,693 →
Application: 10/318,810 →
Publication: US 2003/0116832
Triazine Ring Based Polymers for Photoinduced Liquid Crystal Alignment, Liquid Crystal Alignment Layer Containing the Same, Liquid Crystal Element Using the Alignment Layer and Method of Manufacturing the Same
Patent: 7,067,566 →
Application: 10/415,692 →
Publication: US 2004/0039150
Melt-flow controlling method for elastomer by uv irradiation
Application: 10/494,561 →
Publication: US 2005/0016672
Method of microelectrode connection and connected structure of use threof
Application: 10/522,049 →
Publication: US 2005/0211464
Flat plate heat transferring apparatus and manufacturing method thereof
Application: 10/522,458 →
Publication: US 2006/0124280
Lead Frame Plating Apparatus
Application: 10/538,391 →
Publication: US 2006/0113184
Anisotropic-electroconductive adhesive, circuit connection method and structure using the same
Application: 10/538,801 →
Publication: US 2006/0054277
Flat plate heat transfer device
Application: 10/574,356 →
Publication: US 2007/0068656
Flat plate heat transfer device
Application: 10/580,995 →
Publication: US 2007/0107875
Flat plate heat transfer device and method for manufacturing the same
Application: 10/583,514 →
Publication: US 2007/0163755
Separable Rubber Track of Tank
Application: 10/593,003 →
Publication: US 2008/0238190
Silane Adduct, Manufacturing Thereof and Method for Coupling Organic Die Attach Adhesive and Inorganic Materials Using the Same
Patent: 7,105,625 →
Application: 10/652,667 →
Publication: US 2004/0216840
Absorptive High Temperature Desorber Having Mechanically Narrow Width of Combustion Area and Absorption Chiller-Heater Using the Same
Patent: 6,817,210 →
Application: 10/681,717 →
Method for manufacturing very low roughness electrodeposited copper foil and electrodeposited copper foil manufactured thereby
Application: 10/720,579 →
Publication: US 2004/0104118
Method and Apparatus for Making Very Low Roughness Copper Foil
Patent: 7,112,271 →
Application: 10/722,469 →
Publication: US 2004/0108216
Thermistor Having Symmetrical Structure
Patent: 7,145,431 →
Application: 10/724,484 →
Publication: US 2004/0108936
High Speed Direct Mold Clamping Apparatus of an Injection Molding Machine
Patent: 7,217,115 →
Application: 10/807,756 →
Publication: US 2004/0191361
Injection Unit Having Rotatable Device for Preventing Reverse Flow
Patent: 7,104,775 →
Application: 10/808,818 →
Publication: US 2004/0191359
Surface-Mounted Thermistor and Manufacturing Method Thereof
Patent: 7,173,511 →
Application: 10/859,505 →
Publication: US 2005/0057338
Electrical Device Having Ptc Conductive Polymer
Patent: 6,965,293 →
Application: 10/877,188 →
Publication: US 2004/0233033
Thermistor Having Improved Lead Structure and Secondary Battery Having the Thermistor
Patent: 7,173,512 →
Application: 10/888,309 →
Publication: US 2005/0206494
Anisotropic Conductive Adhesive
Patent: 7,452,923 →
Application: 10/958,825 →
Publication: US 2005/0288427
Flexible metal clad laminate film and a manufacturing method for the same
Application: 10/959,016 →
Publication: US 2005/0266249
Dicing Film Having Shrinkage Release Film and Method of Manufacturing Semiconductor Package Using the Same
Patent: 7,968,977 →
Application: 11/009,246 →
Publication: US 2005/0215032
Electrochemical Device Comprising Electrode Lead Having Protection Device
Patent: 7,618,724 →
Application: 11/103,732 →
Publication: US 2006/0008698
Anisotropic Conductive Adhesive Having Ptc Characteristics
Patent: 7,438,834 →
Application: 11/110,312 →
Publication: US 2006/0118767
Hybrid bearing
Application: 11/158,351 →
Publication: US 2006/0078244
Reacting Functionalized Trialkoxysilane with Polyepoxide or Diamine to Yield Silane Adduct
Patent: 7,408,015 →
Application: 11/311,198 →
Publication: US 2006/0094848
PTC current limiting device having molding part made of insulating material
Application: 11/329,731 →
Publication: US 2006/0152330
PTC current limiting device having flashover prevention structure
Application: 11/330,516 →
Publication: US 2006/0152331
Apparatus for Manufacturing Electrolytic Metal Foil
Patent: 7,641,775 →
Application: 11/330,517 →
Publication: US 2006/0151315
Breaker for Providing Successive Trip Mechanism Based on Ptc Current-Limiting Device
Patent: 7,141,751 →
Application: 11/357,773 →
Publication: US 2006/0186090
Mold Adjustment Device of Injection Molding Machine Provided with Spherical Bearings
Patent: 7,507,082 →
Application: 11/396,418 →
Publication: US 2006/0251758
Dicing Die Adhesive Film for Semiconductor
Patent: 7,485,494 →
Application: 11/413,938 →
Publication: US 2006/0244132
Mold Clamping Unit
Patent: 7,402,037 →
Application: 11/512,373 →
Publication: US 2007/0048401
Dual printing mask for screen printing
Application: 11/593,186 →
Publication: US 2007/0101877
Die-attaching paste composition and method for hardening the same
Application: 11/633,132 →
Publication: US 2007/0134847
Surface-mounted thermistor and manufacturing method thereof
Application: 11/642,771 →
Publication: US 2007/0103269
Carbonaceous electrode material for secondary battery, process for producing the same, and secondary batteries using the same
Application: 11/649,669 →
Publication: US 2007/0154811
Emergency power supply for car
Application: 11/650,060 →
Publication: US 2007/0182247
Digital doorlock having ultra capacitor
Application: 11/650,061 →
Publication: US 2007/0176491
Anode material for secondary battery and secondary batteries using the same
Application: 11/651,361 →
Publication: US 2007/0160908
Piston Head for Hydraulic Injection Molding Machine
Patent: 7,513,191 →
Application: 11/651,373 →
Publication: US 2007/0175325
Anode Material for Secondary Battery, Method for Producing the Same and Secondary Batteries Using the Same
Patent: 7,776,472 →
Application: 11/653,330 →
Publication: US 2007/0166616
Anode material for secondary battery, secondary batteries using the same, method for manufacturing anode material for secondary battery and secondary batteries using the same
Application: 11/698,938 →
Publication: US 2007/0178382
Connecting Structure Between Electrode and Lead, Electric Double Layer Capacitor Having the Same, and Method for Manufacturing the Capacitor
Patent: 7,768,770 →
Application: 11/704,662 →
Publication: US 2007/0188978
Squeeze for Screen Printer
Patent: 7,743,701 →
Application: 11/710,373 →
Publication: US 2007/0199456
Transmission for Tractor
Patent: 7,730,807 →
Application: 11/712,903 →
Publication: US 2007/0204708
Adhesive Film for Semiconductor
Application: 11/915,280 →
Publication: US 2009/0198013
Apparatus and Method of Controlling Injection in Electric Injection Molding Machine
Patent: 7,804,268 →
Application: 11/979,729 →
Publication: US 2008/0129240
Transmission for Tractor
Patent: 7,874,224 →
Application: 12/068,997 →
Publication: US 2008/0282823
Transmission for Tractor
Patent: 7,913,582 →
Application: 12/078,238 →
Publication: US 2008/0287257
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 1996
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Reel/Frame 008172/0382 →
Assignment of Assignor's Interest Dec 23, 1996
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Reel/Frame 008310/0298 →
Assignment of Assignor's Interest Sep 23, 1999
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To: LG CABLE, LTD.
Reel/Frame 010256/0566 →
Assignment of Assignor's Interest Apr 20, 2000
From: DYNACHIP CORPORATION
To: XILINX, INC.
Reel/Frame 010770/0038 →
Assignment of Assignor's Interest Jan 28, 2003
From: KIM, SANG-KYUM; CHOI, CHANG-HEE
To: LG CABLE LTD.
Reel/Frame 013693/0869 →
Assignment of Assignor's Interest Jan 28, 2003
From: KIM, SANG-KYUM; CHOI, CHANG-HEE; KANG, BYOUNG-UN
To: LG CABLE LTD.
Reel/Frame 013693/0986 →
Assignment of Assignor's Interest Feb 25, 2003
From: LEE, DONG-HOON; OH, JONG-SOO; JEONG, HO-YOUL; YANG, KI-MO
To: LG CABLE LTD.
Reel/Frame 013776/0847 →
Assignment of Assignor's Interest Sep 25, 2003
From: SHIN, DONGCHEON; KIM, YINYOOL; PARK, KYUSOON; KIM, TAEMIN
To: LG CABLE LTD.
Reel/Frame 014512/0913 →
Assignment of Assignor's Interest Oct 8, 2003
From: KIM, IG SAENG; KIM, KYUN SEOK; KIM, DO HYUNG; KIM, CHUN DONG
To: LG CABLE LTD.
Reel/Frame 014598/0878 →
Assignment of Assignor's Interest Nov 28, 2003
From: HAN, JUN-KU; CHOI, SU-AN; KO, CHANG-MO; LEE, AN-NA
To: LG CABLE, LTD.
Reel/Frame 014752/0911 →
Assignment of Assignor's Interest Nov 28, 2003
From: JO, CHA JAE; CHOI, CHANGE HEE; KIM, SANGYUM; KIM, JEONG IK
To: LG CABLE LTD.
Reel/Frame 014751/0257 →
Assignment of Assignor's Interest Feb 18, 2004
From: KIM, SANGYUM; CHOI, CHANG HEE; JO, CHA JAE; KIM, JEONG IK
To: LG CABLE LTD.
Reel/Frame 014348/0449 →
Assignment of Assignor's Interest Mar 24, 2004
From: SHIN, SUNG CHUL; PARK, YOUNG JIN; KIM, JIN YOUNG; KIM, DONG SUNG
To: LG CABLE LTD.
Reel/Frame 015142/0604 →
Assignment of Assignor's Interest May 4, 2004
From: KIM, TAE-SUNG; MOON, HYUK-SOO; LEE, JONG-KUL
To: LG CABLE LTD.
Reel/Frame 015894/0056 →
Assignment of Assignor's Interest May 12, 2004
From: KANG, BYOUNG UN; MOON, HYUK SOO; LEE, JONG KUL; WI, KYOUNG TAE
To: LG CABLE LTD.
Reel/Frame 015327/0512 →
Corrective Assignment to Correct the Assignor; Choi, Change Hee Should Be Choi, Chang Hee, Assignee Adress Second Line; Youngdungpo-Ku Should Be Youngdungpo-Ku Previously Recorded on Reel 014751 Frame 0257. Assignor(S) Hereby Confirms the Assignment of Assignors Interest. Aug 27, 2004
From: JO, CHA JAE; CHOI, CHANG HEE; KIM, SANGYUM; KIM, JEONG IK
To: LG CABLE LTD.
Reel/Frame 015089/0919 →
Assignment of Assignor's Interest Jan 20, 2005
From: BYUN, JEONG IL; LEE, KYUNG JUN; LEE, MYUNG KYU; CHUCKSIN, PETER
To: LG CABLE LTD.
Reel/Frame 016720/0257 →
Assignment of Assignor's Interest Jun 9, 2005
From: PARK, WON-CHAN; KIM, CHUL-MIN
To: LG CABLE LTD.
Reel/Frame 017410/0416 →
Assignment of Assignor's Interest Jun 13, 2005
From: BYUN, JUNG-IL; LEE, KYUNG-JUN; JUNG, JAE-YONG
To: LG CABLE LTD.
Reel/Frame 017284/0615 →
To Change the Name and Address of the Assignee Dec 20, 2005
From: LG CABLE LTD.
To: LS CABLE LTD.
Reel/Frame 017135/0379 →
Assignment of Assignor's Interest May 26, 2006
From: LEE, YONG-DUCK; OH, MIN-JUNG; KIM, HYUN-TAE; JANG, SUNG-WOOK
To: LS CABLE LTD.
Reel/Frame 017943/0663 →
Assignment of Assignor's Interest Jun 16, 2006
From: KIM, HYUN-TAE; LEE, YONG-DUCK; OH, MIN-JUNG; JANG, SUNG-WOOK
To: LS CALBE LTD
Reel/Frame 018038/0689 →
Assignment of Assignor's Interest Sep 17, 2006
From: KIM, TAE SUNG; WON, YONG HEE
To: LG CABLE LTD.
Reel/Frame 018328/0378 →
Assignment of Assignor's Interest Aug 7, 2008
From: LEE, YONG-DUCK; HONG, YOUNG-HO; OH, MIN-JUNG; KIM, HYUN-TAE
To: LS CABLE LTD.
Reel/Frame 021356/0439 →
Assignment of Assignor's Interest Aug 7, 2008
From: LEE, YONG-DUCK; HONG, YOUNG-HO; KIM, KU-YOUNG; KIM, HYUN-TAE
To: LG CABLE LTD.
Reel/Frame 021356/0278 →