Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
View Patent ↗The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
1. A dicing film having a shrinkage release film, wherein the dicing film serves to fix a semiconductor die when a semiconductor wafer is diced, the dicing film comprising:
a shrinkage release film having a first and second side made of a material that can shrink when being heated;
a die adhesive film having a thickness of 10 μm to 175 μm coated on a first side of the shrinkage release film;
a polyethylene protection film formed on a upper surface of the die adhesive film; and
an adhesive film for dicing coupled to the second side of the shrinkage release film via an adhesive layer; and
wherein adhesive strength of the shrinkage release film and the adhesive film is higher than that of the shrinkage release film and the die adhesive film, wherein the shrinkage release film is made of polyethylene-2,6-naphthalenedicarboxylate (PEN), which shrinks when being heated.
2. The dicing film as claimed in claim 1 , wherein the die adhesive film is formed using a polyimide adhesive.
3. The dicing film as claimed in claim 1 , wherein the adhesive film is formed using a polyolefin adhesive.
4. The dicing film as claimed in claim 1 , wherein the die adhesive film is formed using an epoxy adhesive.