Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same

1. A silane adduct as expressed formula below,

wherein, X is a dehydrogenated form selected from the group consisting of epoxy compounds, amino compounds and bisphenolics; and R 1 is a organoalkyl group, which is one of the functional group selected from the group consisting of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-[2-(2-aminoethylamino)ethylamino]propyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N,N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.

2. The silane adduct according to claim 1 , wherein the epoxy compound is selected from one of diglycidyl ether of bisphenol A (Mn=380˜50,000), diglycidyl ether of bisphenol F (Mn=340˜4,000), phenol-novolac epoxy, o-cresol novolac epoxy, bisphenol A-novolac epoxy, and diglycidyl terephtalate.

3. The silane adduct according to claim 1 , wherein the amino compound is selected from one of imidazole, piperidine, dicyandiamide, 4,4,′-diaminodiphenylsulfone(DDS), 4,4′-diaminodiphenylmethane(DDM), 4,4′-diaminodiphenylpropane, 4,4′-oxydianiline, 1,4-cyclohexanediamine, hexamethylenediamine, heptamethylenediamine, nonamethylenediamine, decamethylenediamine, 2,4-diaminotoluene, and 2,6-diaminotoluene.

4. The silane adduct according to claim 1 , wherein the bisphenolics is selected from one of 4,4′-isopropylidene diphenol, 4,4′-isopropylidenebis(2,6-dimethyl phenol), 4,4′-ethylidenebisphenol, Bis(4-hydroxyphenyl)methane, 4,4′-(1,3-phenylenediisopropylidene)bisphenol, 4,4′-(1,4-phenylenedi-isopropylidene)bisphenol, 4,4′-Sulfonyldiphenol, 4,4′-cyclohexylidene bisphenol, and bis(4-hydroxyphenyl)-2,2-dichloroethylene.