Semiconductor device having a retrograde dopant profile in a channel region and method for fabricating the same
View Patent ↗An epitaxially grown channel layer is provided on a well structure after ion implantation steps and heat treatment steps are performed to establish a required dopant profile in the well structure. The channel layer may be undoped or slightly doped, as required, so that the finally obtained dopant concentration in the channel layer is significantly reduced compared to a conventional device to thereby provide a retrograde dopant profile in a channel region of a field effect transistor. Additionally, a barrier diffusion layer may be provided between the well structure and the channel layer to reduce up-diffusion during any heat treatments carried out after the formation of the channel layer. The final dopant profile in the channel region may be adjusted by the thickness of the channel layer, the thickness and the composition of the diffusion barrier layer and any additional implantation steps to introduce dopant atoms in the channel layer.
1. A method of forming a retrograde dopant profile in a channel region of a field effect transistor, the method comprising:
forming a well structure in a substrate;
epitaxially growing a channel layer above said well structure;
epitaxially growing a diffusion barrier layer prior to growing said channel layer, wherein diffusion of dopants present within said well structure through said diffusion barrier layer is reduced;
forming a gate insulation layer and a gate electrode above said channel layer; and
forming a drain and a source region in said well structure with said channel region located between the drain region and the source region.
2. The method of claim 1 , wherein forming a well structure includes implanting dopant ions into the substrate and heat treating the substrate to activate the dopant atoms and to cure lattice damage.
3. The method of claim 2 , further comprising controlling at least one of a thickness of the channel layer and an implantation parameter to control the retrograde dopant profile in the channel layer.
4. The method of claim 1 , further comprising controlling at least one of an implantation parameter for introducing dopants into the well structure, a thickness of the channel layer and a thickness of the diffusion barrier layer.
5. The method of claim 1 , further comprising implanting ions into the channel layer prior to forming the gate insulation layer to adjust a threshold voltage of the field effect transistor.
6. The method of claim 1 , wherein epitaxially growing said diffusion barrier layer includes controlling the material composition in said diffusion barrier layer and controlling a thickness of said diffusion barrier layer to adjust a diffusion-hindering property of the diffusion barrier layer.
7. The method of claim 1 , wherein a thickness of said channel layer is in the range of approximately 10-100 nanometers.
8. The method of claim 1 , wherein a thickness of the diffusion barrier layer is in the range of approximately 2-20 nanometers.
9. The method of claim 1 , wherein at least one of phosphorous and arsenic atoms are provided within said well structure and said diffusion barrier layer comprises a silicon germanium compound.
10. The method of claim 9 , wherein a ratio of germanium atoms to silicon atoms in said diffusion barrier layer is approximately 1-30% atoms.
11. The method of claim 1 , wherein, during epitaxially growing said channel layer, a dopant concentration of said channel layer is controlled.
12. A method of selectively forming a retrograde dopant profile in a semiconductor region formed on a substrate, the method comprising:
forming a first well structure in a first portion of the semiconductor region;
forming a second well structure in a second portion of the semiconductor region;
forming a mask layer over the second well structure;
selectively epitaxially growing a channel layer over the first well structure, wherein said mask layer prevents growing of the channel layer on the second well structure; and
selectively epitaxially growing a diffusion barrier layer over the first well structure prior to growing said channel layer.
13. The method of claim 12 , wherein said mask layer comprises one of silicon dioxide, silicon nitride and silicon-reacted nitride.
14. The method of claim 12 , further comprising forming an etch stop layer on the second well structure prior to forming said mask layer.
15. The method of claim 12 , further comprising controlling the retrograde dopant profile by controlling at least one of an implantation parameter during formation of said first well structure and a thickness of the channel layer.
16. The method of claim 12 , further comprising controlling at least one of an implantation parameter during the formation of the first well structure, a thickness of the channel layer and a thickness of the diffusion barrier layer.
17. The method of claim 12 , further comprising forming a gate insulation layer on the first and second well structures.
18. The method of claim 12 , further comprising forming a recess in said first portion of the semiconductor region prior to growing said channel layer, wherein said first well structure is formed by ion implantation prior to forming said recess, whereby implantation parameters are controlled to obtain a required dopant profile in said first well structure after recess formation.
19. The method of claim 18 , wherein said formation of the first well structure is performed by ion implantation after forming said recess.
20. The method of claim 12 , further comprising implanting ions into said channel layer to adjust a threshold voltage.
21. The method of claim 12 , wherein a thickness of the channel layer is in the range of approximately 10-100 nm.
22. The method of claim 12 , wherein a thickness of said diffusion barrier layer is in the range of approximately 2-20 nm.
23. A method of selectively forming a retrograde dopant profile in a semiconductor region formed on a substrate, the method comprising:
forming a first well structure in a first portion of the semiconductor region;
forming a second well structure in a second portion of the semiconductor region;
forming a mask layer over the second well structure;
forming a recess in said first portion of the semiconducting region; and
after forming said recess, selectively epitaxially growing a channel layer over the first well structure, wherein said mask layer prevents growing of the channel layer on the second well structure.
24. The method of claim 23 , further comprising forming an etch stop layer on the second well structure prior to forming said mask layer.
25. The method of claim 23 , further comprising selectively epitaxially growing a diffusion barrier layer prior to growing said channel layer.
26. The method of claim 23 , wherein forming a gate insulation layer includes removing the mask layer and forming the gate insulation layer on the first and second well structures.
27. The method of claim 26 , wherein forming a gate insulation layer includes:
forming a first portion of the gate insulation layer on the first well structure;
removing the mask layer; and
forming a second portion on the second well structure, while increasing the thickness of the first portion.
28. The method of claim 23 , wherein said first well structure is formed by ion implantation prior to forming said recess, whereby implantation parameters are controlled to obtain a required dopant profile in said first well structure after recess formation.
29. The method of claim 23 , wherein said formation of the first well structure is performed by ion implantation after forming said recess.
30. The method of claim 23 , further comprising implanting ions into said channel layer to adjust a threshold voltage.
31. The method of claim 23 , further comprising forming a first and a second transistor element in the first and second well structures, respectively.
32. The method of claim 31 , wherein first and second transistor elements are a P-channel and an N-channel field effect transistor, respectively.
33. A method of selectively forming a retrograde dopant profile in a semiconductor region formed on a substrate, the method comprising:
forming a first well structure in a first portion of the semiconductor region;
forming a second well structure in a second portion of the semiconductor region;
forming a mask layer over the second well structure;
selectively epitaxially growing a channel layer over the first well structure, wherein said mask layer prevents growing of the channel layer on the second well structure; and
forming a gate insulation layer on the first and second well structures, wherein forming said gate insulation layer comprises:
forming a first portion of the gate insulation layer on the first well structure;
removing the mask layer; and
forming a second portion on the second well structure, while increasing the thickness of the first portion of the gate insulation layer.
34. The method of claim 33 , further comprising forming an etch stop layer on the second well structure prior to forming said mask layer.
35. The method of claim 33 , further comprising selectively epitaxially growing a diffusion barrier layer prior to growing said channel layer.
36. The method of claim 33 , further comprising forming a recess in said first portion of the semiconductor region prior to growing said channel layer, wherein said first well structure is formed by ion implantation prior to forming said recess, whereby implantation parameters are controlled to obtain a required dopant profile in said first well structure after recess formation.
37. The method of claim 36 , wherein said formation of the first well structure is performed by ion implantation after forming said recess.
38. The method of claim 33 , further comprising forming a first and a second transistor element in the first and second well structures, respectively.
39. The method of claim 38 , wherein first and second transistor elements are a P-channel and an N-channel field effect transistor, respectively.
40. A method of selectively forming a retrograde dopant profile in a semiconductor region formed on a substrate, the method comprising:
forming a first well structure in a first portion of the semiconductor region;
forming a second well structure in a second portion of the semiconductor region;
forming a mask layer over the second well structure;
selectively epitaxially growing a channel layer over the first well structure, wherein said mask layer prevents growing of the channel layer on the second well structure; and
forming a first and a second transistor element in the first and second well structures, respectively, wherein said first and second transistor elements are a P-channel and an N-channel field effect transistor, respectively.
41. The method of claim 40 , further comprising forming an etch stop layer on the second well structure prior to forming said mask layer.
42. The method of claim 40 , further comprising selectively epitaxially growing a diffusion barrier layer prior to growing said channel layer.
43. The method of claim 40 , further comprising forming a recess in said first portion of the semiconductor region prior to growing said channel layer, wherein said first well structure is formed by ion implantation prior to forming said recess, whereby implantation parameters are controlled to obtain a required dopant profile in said first well structure after recess formation.
44. A method of forming a retrograde dopant profile in a channel region of a field effect transistor, the method comprising:
forming a well structure in a substrate;
forming a recess in said well structure;
after forming said recess, epitaxially growing a channel layer above said well structure;
forming a gate insulation layer and a gate electrode above said channel layer; and
forming a drain and a source region in said well structure with said channel region located between the drain region and the source region.
45. The method of claim 44 , further comprising epitaxially growing a diffusion barrier layer prior to growing said channel layer, wherein diffusion of dopants present within said well structure through said diffusion barrier layer is reduced.
46. The method of claim 44 , further comprising controlling at least one of a thickness of the channel layer and an implantation parameter to control the retrograde dopant profile in the channel layer.
47. The method of claim 45 , wherein epitaxially growing said diffusion barrier layer includes controlling the material composition in said diffusion barrier layer and controlling a thickness of said diffusion barrier layer to adjust a diffusion-hindering property of the diffusion barrier layer.
48. The method of claim 45 , wherein at least one of phosphorous and arsenic atoms are provided within said well structure and said diffusion barrier layer comprises a silicon germanium compound.
49. The method of claim 44 , wherein, during epitaxially growing said channel layer, a dopant concentration of said channel layer is controlled.