Ball grid array package enhanced with a thermal and electrical connector
View Patent ↗Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. A substrate has a surface, wherein the surface has an opening therein. A stiffener has a surface coupled to the surface of the substrate. An area of the surface of the stiffener can be greater than, equal to, or less than an area of the surface of the substrate. A thermal connector is coupled to the surface of the stiffener through the opening. A surface of the thermal connector is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB. The thermal connector can have a height such that the thermal connector extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB. Alternatively, the stiffener and thermal connector may be combined into a single piece stiffener, wherein the stiffener has a protruding portion. The protruding portion extends through the opening when the stiffener is coupled to the substrate, and is capable of attachment to the PCB.
1. A ball grid array (BGA) package, comprising:
a flexible substrate that has first and second surfaces, the substrate having a plurality of solder ball contacts on said first surface for an attachment to a printed circuit board (PCB) and having an opening therein that is open at said first and second surfaces;
a rigid stiffener that has a planar first surface coupled to said second surface of said substrate so that said first surface of said stiffener is substantially coplanar with said second surface of said substrate and covers said opening, and wherein an area of said first surface of said stiffener is less than an area of said second surface of said substrate; and
a thermal connector that has first and second surfaces, wherein said second surface of said thermal connector is coupled to said first surface of said stiffener through said opening, and wherein said first surface of said thermal connector is capable of attachment to the PCB when the BGA package is mounted to the PCB.
2. The package of claim 1 , further comprising:
an IC die mounted to a second surface of said stiffener.
3. The package of claim 2 , further comprising:
an encapsulate material that encapsulates said IC die on said second surface of said stiffener.
4. The package of claim 2 , further comprising:
a dam attached to said second surface of said substrate around said IC die; and
an encapsulate material within a boundary of said dam to encapsulate said IC die.
5. The package of claim 1 , wherein said stiffener has an edge, wherein at least a portion of said edge is patterned.
6. The package of claim 1 , wherein said thermal connector is a heat sink.
7. The package of claim 1 , wherein said thermal connector is a heat spreader.
8. The package of claim 1 , wherein said thermal connector is a heat slug.