Method of fabricating and using an image sensor package
View Patent ↗An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.
1. A method of forming an image sensor package comprising:
coupling an image sensor to a substrate;
forming an optical lid, said optical lid comprising:
an optical element; and
a snapping feature; and
coupling said optical lid to said substrate comprising:
mounting a molding comprising a locking feature to said substrate; and
snapping said snapping feature to said locking feature.
2. The method of claim 1 wherein said substrate is a ceramic substrate.
3. The method of claim 1 wherein said image sensor is selected from the group consisting of a CMOS image sensor device, a charge coupled device and a pyroelectric ceramic on CMOS device.
4. The method of claim 1 wherein said optical element comprises a lens.
5. The method of claim 1 wherein said optical element comprises a window.
6. The method of claim 5 wherein said window comprises a filter.
7. The method of claim 1 wherein said optical element consists of a lens.
8. The method of claim 1 wherein said image sensor package is a leadless chip carrier (LCC) package.
9. The method of claim 1 wherein said molding is mounted to said substrate with an adhesive layer.
10. The method of claim 9 wherein said molding, said substrate and said adhesive layer form an enclosure, said image sensor being located in said enclosure.
11. The method of claim 1 wherein said optical lid is coupled to said substrate by an adhesive layer.
12. A method of forming an image sensor package comprising:
forming a means for supporting an optical element, said means for supporting comprising:
a threaded interior cylindrical surface defining an aperture; and
a pocket for supporting said optical element;
placing said optical element in said pocket;
threadedly attaching a threaded exterior cylindrical surface of a support to said threaded interior cylindrical surface of said means for supporting; and
coupling said means for supporting to a first surface of a substrate, said substrate comprising means for electrically connecting said image sensor package to a printed circuit board, said means for electrically connecting being coupled to a second surface of said substrate.
13. The method of claim 12 wherein said optical element comprises a lens.
14. The method of claim 12 wherein said substrate comprises a ceramic substrate, said image sensor package being an leadless chip carrier (LCC) package.