Conductive resin composition and electrode substrate using the same and method of manufacturing the electrode substrate
A method of the invention manufactures a conductive resin composition having powdered silver and a reinforcing agent of the Mohs hardness 3.5 to 4.5 contained in binder resin, and forms an electrode substrate by use of the conductive resin composition. Thereby, hardness balance between phosphor copper and an electrode is regulated into the most appropriate state, and a wear resistance of both can be enhanced.
1. An electrode substrate comprising:
a substrate composed of polyethylene terephthalate; and
an electrode composed of a conductive resin composition formed on the substrate,
wherein the electrode slides on a sliding contact, and the conductive resin composition contains at least binder resin, powdered silver, and a reinforcing agent which is powdered nickel having a Mohs hardness of 3.5 to 4.5.
2. The electrode substrate according to claim 1 , wherein the conductive resin composition is made with a combination rate of 62 to 73% by volume of the binder resin, 24 to 34% by volume of the powdered silver, and 2 to 5% by volume of the reinforcing agent.
3. The electrode substrate according to claim 1 , wherein the reinforcing agent is powdered nickel having small spike-like protrusions on a surface thereof.
4. The electrode substrate according to claim 1 , wherein the powdered silver is made of at least one kind of spherical powdered silver, dendrite powdered silver, and flake powdered (form) silver.