IP Library Granted Patent US 7,095,101
Granted Patent B2
US 7,095,101 · App. 10/308,274 · Granted Aug 22, 2006

Supporting frame for surface-mount diode package

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Quick Facts
Patent No.
US 7,095,101
App. No.
10/308,274
Granted
Aug 22, 2006
Kind
B2
Abstract

A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip.

Claims (7)

1. A surface mount diode package, comprising:

a diode chip having a first electrode and a second electrode;

a first metallic contact coupled to said first electrode for surface mounting;

a second metallic contact coupled to said second electrode for surface mounting; and

a metal supporting frame surrounding said diode chip and solidly bridging between said first metallic contact and said second metallic contact to prevent bending of said single diode chip.

2. The surface mount diode package as described in claim 1 , wherein said first electrode and said second electrode are located at the bottom of said chip and soldered to said first metallic contact and second metallic contact respectively, and

said supporting frame is also soldered to said first metallic contact and said second metallic contact.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2011
From: WU, JIAHN-CHANG
To: CHENG KUNG CAPITAL, LLC
Reel/Frame 026869/0640 →