Patent Assignment
Reel/Frame 026869/0640
Assignment of Assignor's Interest
Recorded: 2011-09-08
Received: 2011-09-08
Pages: 11
Assignor
WU, JIAHN-CHANG
Executed: 2011-08-05
Assignee
CHENG KUNG CAPITAL, LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DE, 19808, UNITED STATES
Covered Properties
(35)
Led Package with Top and Bottom Electrodes
Application:
12/554,189 →
Internal Circulation Mechanism for an Air-Tight Led Lamp
Application:
12/328,817 →
Swinging Lead Switch for an Electronic Device
Application:
12/327,989 →
Lamp Chess Module
Application:
12/327,227 →
Master Cylinder Lever with Variable Dead Band and Variable Reach Adjustment Independent of the Dead Band Adjustment
Application:
12/147,259 →
Submount for Diode with Single Bottom Electrode
Application:
12/154,977 →
Reflection Lamp
Application:
12/041,109 →
Waterproof Module for Led Lamp
Application:
11/952,639 →
Light Emitting Diode Package with Coaxial Leads
Application:
11/902,931 →
Light Unit Display
Application:
11/893,161 →
Light Emitting Diode Package with Coaxial Leads
Application:
11/728,610 →
Supporting Frame for Surface-Mount Diode Package
Application:
11/636,708 →
A Light Unit with Staggered Electrodes
Application:
11/459,377 →
Backside Accessible Display
Application:
11/458,842 →
Lighting Board Using Cassette Light Unit
Application:
11/458,810 →
Matrix Display Using Cassette Light Units
Application:
11/458,826 →
Decoration Tree with Inserted Articles
Application:
11/425,829 →
Coaxial LED lighting board
Application:
11/262,820 →
Supporting Frame for Surface-Mount Diode Package
Application:
11/199,925 →
Light Emitting Diode Package with Coaxial Leads
Application:
11/183,076 →
Ballast for Light Emitting Device
Application:
11/107,267 →
Light Unit Display
Application:
11/105,745 →
Replaceable Light Emitting Diode Module
Application:
11/082,131 →
Submount for Diode with Single Bottom Electrode
Application:
10/847,225 →
Projector with Uv Light Source
Application:
10/441,363 →
Flexible Lead Surface-Mount Semiconductor Package
Application:
10/404,793 →
Supporting Frame for Surface-Mount Diode Package
Application:
10/308,274 →
Package for semiconductor photoelectric device
Application:
10/228,313 →
Led Matrix Substrate with Convection Holes
Application:
10/172,728 →
Projection Lamp with Led Matrix Panel
Application:
10/156,286 →
Projector with Array Led Matrix Light Source
Application:
10/139,780 →
Ventilated Light Emitting Diode Matrix Panel
Application:
09/982,371 →
Light Emitting Diode Display Having Heat Sinking Circuit Rails
Application:
09/848,993 →
Flexible lead surface-mount semiconductor package
Application:
09/756,007 →
Semiconductor matrix formation
Application:
09/756,611 →