IP Library Patent Application 12154977
Patent Application
App. No. 12/154,977

Submount for diode with single bottom electrode

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
12/154,977
Abstract

A submount is used to mount a diode between two metal areas on the upper surface of a substrate. One of the areas is connected to a metal plate at the lower surface of the substrate through a via. The submount is clamped between two metal sheets. The top metal sheet has a through-hole for anchoring and self-aligning the diode. The electrodes of the diode are each coupled to one of the clamping metal sheets. Clamping metals provide pressure contact without soldering to the contact. But soldering can be alternatively used to enhance product reliability. Either the top metal sheet or the bottom metal sheet can be fully or selectively coating of solder for batch soldering at the contact point upon heating. The large metal plates and the large metal clamping sheets provide good heat sink and speedy soldering.

Claims (12)

1 . A display module with a submount for a diode, comprising:

a substrate;

a first upper metal area on a top surface of said substrate;

a second upper metal area on a top surface of said substrate encircling the first upper metal area;

a lower metal area covering a bottom surface of said substrate;

an electrically conducting conduit, coupling said first upper metal area with said lower metal area;

a diode chip having a first electrode and a second electrode electrically coupling respectively to said first upper metal area and said second upper metal area;

a top metal sheet, having a through hole to anchor said diode chip, electrically coupling to said second upper metal area; and

a bottom metal sheet, below said diode chip, electrically coupling to said lower metal area.

2 . The module as described in claim 1 , further comprising a transparent material to cover said through-hole.

3 . The module as described in claim 1 , further comprising a protective glue to cover said diode chip.

4 . The module as described in claim 1 , wherein the top metal sheet is of zigzag metal, the zigzag metal having a lower section which having a bottom surface coplanar with a bottom surface of said bottom metal sheet.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2011
From: WU, JIAHN-CHANG
To: CHENG KUNG CAPITAL, LLC
Reel/Frame 026869/0640 →