IP Library Granted Patent US 7,586,247
Granted Patent B2
US 7,586,247 · App. 11/107,267 · Granted Sep 8, 2009

Ballast for light emitting device

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Quick Facts
Patent No.
US 7,586,247
App. No.
11/107,267
Granted
Sep 8, 2009
Kind
B2
Abstract

A thin resistive layer is connected in series and integrated with a light emitting device as a ballast to stabilize the current through the light emitting device.

Claims (10)

1. An integrated light emitting structure, comprising:

a light emitting device having a top electrode and a bottom electrode; and

a resistive layer integrated with said light emitting device, completely disposed on and contacting a top surface of said top electrode,

wherein said resistive layer has an occupation no larger than the surface area of said top surface of said top electrode and defines a ballast resistance to stabilize current in said light emitting device.

2. The integrated light emitting structure as described in claim 1 , wherein said resistive layer has a window to allow transmission of light from said light emitting device.

3. The integrated light emitting structure as described in claim 2 , further comprising a glue disposed in said window for modifying light emitted from said light emitting device.

4. An integrated light emitting structure, comprising:

a light emitting device having a top electrode and a bottom electrode; and

a resistive layer integrated with said light emitting device, completely disposed on and contacting a bottom surface of said bottom electrode,

wherein said resistive layer has an occupation no larger than the surface area of said bottom surface of said bottom electrode and defines a ballast resistance to stabilize current in said light emitting device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2011
From: WU, JIAHN-CHANG
To: CHENG KUNG CAPITAL, LLC
Reel/Frame 026869/0640 →