Utilizing atomic layer deposition for programmable device
View Patent ↗In an aspect, an apparatus is provided that sets and reprograms the state of programmable devices. In an aspect, a method is provided such that an opening is formed through a dielectric exposing a contact, the contact formed on a substrate. An electrode is conformally deposited on a wall of the dielectric, utilizing atomic layer deposition (ALD). A programmable material is formed on the electrode and a conductor is formed to the programmable material. In an aspect, a barrier is conformally deposited utilizing ALD, between the electrode and the programmable material.
1. An apparatus comprising:
a contact on a substrate;
a dielectric on the contact, the dielectric having an opening exposing the contact;
an electrode on the opening in said dielectric, said electrode including a series of stacked monolayers; a programmable material on the electrode; and a conductor formed to the programmable material; wherein the electrode has a resistivity from 0.001 ohm-cm to 0.05 ohm-cm, and the electrode comprises at least one of tungsten (W), tungsten nitride (WN), titanium nitride (TiN), titanium silicon nitride (TiSiN), and tantalum nitride (TaN).
2. The apparatus of claim 1 , further comprising:
a barrier, deposited by ALD, between the electrode and the programmable material, the barrier comprising at least one of titanium silicide and titanium nitride.
3. The apparatus of claim 1 , wherein the electrode has a film thickness from 10 angstroms to 1000 angstroms.
4. The apparatus of claim 1 , wherein the programmable material comprises a chalcogenide memory element.