Cooling micro-channels
The present disclosure relates generally to microelectronic technology, and more specifically, to an apparatus used for the cooling of active electronic devices utilizing micro-channels or micro-trenches, and a technique for fabricating the same.
1. An apparatus comprising:
a first semiconductor structure including internal integrated cooling channels;
a first bonding layer;
a second bonding layer bonded to said first bonding layer; and
a second semiconductor structure bonded to the first second semiconductor structure and including a layer of semiconductor material having a cleave plane formed therein wherein said second semiconductor structure includes a sacrificial layer.
2. The apparatus of claim 1 wherein at least one of said bonding layers includes silicon dioxide.
3. The apparatus of claim 1 wherein said second semiconductor structure is an active layer including integrated circuit devices.