Methods for analyzing solder plating solutions

1. A method for determining tin concentration in a sample solder plating solution comprising tin and lead ions, by titrating said sample solder plating solution with a titration solution that comprises a material selected from the group consisting of iodine and iodide, and by measuring reduction-oxidation potential responses of said sample solder plating solution, during the titration, said method comprising the steps of:

(a) adding a stabilizing solution into the sample solder plating solution, for stabilizing the lead ions therein to prevent precipitation of said lead ions during subsequent titration;

(b) titrating the sample solder plating solution with the titration solution comprising iodine;

(c) monitoring oxidation-reduction potential of the sample solder plating solution during the iodine titration by using an oxidation-reduction potential electrode, for determining an end point of said titration; and

(d) calculating the tin concentration in the sample solder plating solution, based on the titration end point determined in step (c),

wherein the oxidation-reduction potential electrode comprises dual polarized platinum electrodes.

2. A method for determining lead concentration in a sample solder plating solution that comprises tin and lead ions, comprising the steps of:

(a) determining the total metal concentration in said sample solder plating solution;

(b) determining the tin concentration in said sample solder plating solution, by titrating said sample solder plating solution with a titration solution that comprises a material selected from the group consisting of iodine and iodide, and by measuring reduction-oxidation potential responses of said sample solder plating solution during the titration;

(c) calculating the lead concentration in said sample solder plating solution, by subtracting the tin concentration from the total metal concentration.

3. The method of claim 2 , wherein the total metal concentration in said sample solder plating solution is determined by a titration method, which comprises the steps of:

(a) adding excess amount of complexing agent into the sample solder plating solution, so that metal ions in said sample solution form complexes with the complexing agent;

(b) titrating the sample solution with a titration solution, for consuming the excess complexing agent not complexed with the metal ions in the sample solder plating solution;

(c) monitoring the titration process for determining a titration end point, wherein amount of titration solution used for reaching such titration end point is recorded; and

(d) calculating the total metal concentration in the sample solder plating solution, based on the amount of complexing agent added into the sample solution and the amount of titration solution used for consuming the excess complexing agent therein.

4. The method of claim 3 , wherein the sample solder plating solution is diluted before the complexing agent is added.

5. The method of claim 3 , wherein the complexing agent comprises ethylenediaminetetraacetate (EDTA).

6. The method of claim 5 , wherein ammonia acetate is used in combination with said complexing agent for adjusting pH value of the sample solder plating solution to above about 4.

7. The method of claim 5 , wherein the titration solution comprises copper sulfate, for consuming the excess EDTA not complexed with the metal ions in the sample solder plating solution.

8. The method of claim 7 , wherein the titration is monitored by using an ion selective electrode selected from the group consisting of cadmium ion selective electrodes and calcium ion selective electrodes.