Patent Assignment
Reel/Frame 027155/0035
Assignment of Assignor's Interest
Recorded: 2011-11-01
Received: 2011-11-01
Pages: 56
Assignor
SEMITOOL INC
Executed: 2011-10-21
Assignee
APPLIED MATERIALS INC.
3050 BOWERS AVENUE, SANTA CLARA, CA, 95054, UNITED STATES
Covered Properties
(100)
Photoresist Removing Processor and Methods
Application:
12/717,079 →
Method of Forming Metal and Metal Alloy Features
Application:
11/840,748 →
Single Side Workpiece Processing
Application:
11/782,159 →
High Throughput Semiconductor Wafer Processing
Application:
11/778,576 →
Single Side Workpiece Processing
Application:
11/678,931 →
Electro-Chemical Processor with Wafer Retainer
Application:
11/674,912 →
Apparatus and Methods for Electrochemical Processing of Microfeature Wafers
Application:
11/699,768 →
System for Processing a Workpiece
Application:
11/620,508 →
Electro-Chemical Processor
Application:
11/608,151 →
Apparatus and Method for Agitating Liquids in Wet Chemical Processing of Microfeature Workpieces
Application:
11/603,940 →
Electro-Chemical Processor
Application:
11/467,232 →
Electro-Chemical Processor
Application:
11/457,192 →
Thermal Wafer Processor
Application:
11/428,742 →
Electrolytic Copper Process Using Anion Permeable Barrier
Application:
11/416,659 →
Electrolytic Process Using Cation Permeable Barrier
Application:
11/414,145 →
Single Side Workpiece Processing
Application:
11/359,969 →
End Point Detection in Workpiece Processing
Application:
11/288,770 →
Microelectronic Workpiece Holders and Contact Assemblies for Use Therewith
Application:
11/248,667 →
Systems and Methods for Electrochemically Processing Microfeature Workpieces
Application:
11/218,324 →
Method and System for Idle State Operation
Application:
11/198,905 →
Integrated Tool Assemblies with Intermediate Processing Modules for Processing of Microfeature Workpieces
Application:
11/178,250 →
System and Methods for Polishing a Wafer
Application:
11/127,052 →
Sonic Energy Process Chamber
Application:
11/078,997 →
Single Workpiece Processing Chamber with Tilting Load/Unload Upper Rim
Application:
11/075,099 →
Processing a Workpiece Using Water, a Base, and Ozone
Application:
11/005,495 →
Method and Apparatus for Thermally Processing Microelectronic Workpieces
Application:
10/987,049 →
Contact Assemblies for Electrochemical Processing of Microelectronic Workpieces and Method of Making Thereof
Application:
10/497,670 →
Process for Thinning a Semiconductor Workpiece
Application:
10/923,363 →
Semiconductor Workpiece
Application:
10/923,132 →
Process and Apparatus for Thinning a Semiconductor Workpiece
Application:
10/923,131 →
Process and Apparatus for Treating a Workpiece with Gases
Application:
10/870,173 →
System for Processing a Workpiece
Application:
10/867,458 →
Chambers, Systems, and Methods for Electrochemically Processing Microfeature Workpieces
Application:
10/861,899 →
Integrated Tool with Interchangeable Wet Processing Components for Processing Microfeature Workpieces
Application:
10/860,593 →
Process and Apparatus for Treating a Workpiece Using Ozone
Application:
10/859,668 →
Integrated Tool with Automated Calibration System and Interchangeable Wet Processing Components for Processing Microfeature Workpieces
Application:
10/860,385 →
Integrated Tool with Interchangeable Wet Processing Components for Processing Microfeature Workpieces and Automated Calibration Systems
Application:
10/861,240 →
Reactors Having Multiple Electrodes and/or Enclosed Reciprocating Paddles, and Associated Methods
Application:
10/734,100 →
Paddles and Enclosures for Enhancing Mass Transfer During Processing of Microfeature Workpieces
Application:
10/734,098 →
Integrated Microfeature Workpiece Processing Tools with Registration Systems for Paddle Reactors
Application:
10/733,807 →
Chambers, Systems, and Methods for Electrochemically Processing Microfeature Workpieces
Application:
10/729,357 →
Chambers, Systems, and Methods for Electrochemically Processing Microfeature Workpieces
Application:
10/729,349 →
Single Workpiece Processing System
Application:
10/693,668 →
Methods for Removing Metallic Contamination from Wafer Containers
Application:
10/692,829 →
Single Workpiece Processing System
Application:
10/691,688 →
Platinum Alloy Using Electrochemical Deposition
Application:
10/667,802 →
Thiourea-And Cyanide-Free Bath and Process for Electrolytic Etching of Gold
Application:
10/667,795 →
Selective Treatment of Microelectronic Workpiece Surfaces
Application:
10/632,495 →
Methods of Thinning a Silicon Wafer Using Hf and Ozone
Application:
10/631,376 →
Method for Applying Metal Features Onto Barrier Layers Using Electrochemical Deposition
Application:
10/470,287 →
Method and Apparatus for Securing Microelectronic Workpiece Containers
Application:
10/622,018 →
Apparatuses and Method for Transferring and/or Pre-Processing Microelectronic Workpieces
Application:
10/621,037 →
End-Effectors and Transfer Devices for Handling Microelectronic Workpieces
Application:
10/620,326 →
Vapor Phase Etching Mems Devices
Application:
10/464,597 →
Method and Apparatus for Controlling Vessel Characteristics, Including Shape and Thieving Current for Processing Microfeature Workpieces
Application:
10/426,029 →
Wafer Handling System
Application:
10/397,946 →
Methods for Controlling and/or Measuring Additive Concentration in an Electroplating Bath
Application:
10/266,966 →
Apparatus for Controlling and/or Measuring Additive Concentration in an Electroplating Bath
Application:
10/372,955 →
Automated Processing System
Application:
10/334,688 →
Analysis of Antioxidant in Solder Plating Solutions Using Molybdenum Dichloride Dioxide
Application:
10/320,875 →
Methods for Analyzing Solder Plating Solutions
Application:
10/315,629 →
Apparatus and Method for Electrolytically Depositing Copper on a Semiconductor Workpiece
Application:
10/302,711 →
Apparatus and Method for Thermally Controlled Processing of Microelectronic Workpieces
Application:
10/295,302 →
Wafer Container Cleaning System
Application:
10/286,317 →
Apparatus and Methods for Electrochemical Processing of Microelectronic Workpieces
Application:
10/234,442 →
Apparatus and Method for Deposition of an Electrophoretic Emulsion
Application:
10/234,628 →
Apparatus and Method for Deposition of an Electrophoretic Emulsion
Application:
10/234,982 →
Apparatus and Method for Deposition of an Electrophoretic Emulsion
Application:
10/234,637 →
Centrifugal Spray Processor and Retrofit Kit
Application:
10/199,998 →
Centrifugal Swing Arm Spray Processor
Application:
10/200,072 →
Cross Flow Processor
Application:
10/200,073 →
Automated System for Handling and Processing Wafers Within a Carrier
Application:
10/200,074 →
Sonic Immersion Process System and Methods
Application:
10/200,043 →
End-Effectors for Handling Microelectronic Wafers
Application:
10/194,939 →
End-Effectors for Handling Microelectronic Workpieces
Application:
10/195,137 →
Apparatus and Method for Loading of Carriers Containing Semiconductor Wafers and Other Media
Application:
10/185,773 →
Method for Determining Concentrations of Additives in Acid Copper Electrochemical Deposition Baths
Application:
10/064,125 →
Electroplating Reactor
Application:
10/154,426 →
Wafer Container Cleaning System
Application:
10/108,278 →
Method and Apparatus for Manually and Automatically Processing Microelectronic Workpieces
Application:
10/080,914 →
Microelectronic Workpiece Transfer Devices and Methods of Using Such Devices in the Processing of Microelectronic Workpieces
Application:
10/080,910 →
Methods and Apparatus for Controlling an Amount of a Chemical Constituent of an Electrochemical Bath
Application:
09/683,597 →
Side-Specific Cleaning Method and Apparatus
Application:
10/055,302 →
Processing a workpiece using ozone and sonic energy
Application:
10/051,860 →
Method and Apparatus for Cleaning Containers
Application:
10/043,716 →
Process for Etching Thin-Film Layers of a Workpiece Used to Form Microelectronic Circuits or Components
Application:
09/999,112 →
Automated Chemical Management System Executing Improved Electrolyte Analysis Method
Application:
09/931,268 →
Automated Chemical Management System Having Improved Analysis Unit
Application:
09/931,283 →
Robot for Handling Workpieces in an Automated Processing System
Application:
09/907,523 →
Multi-Process System with Pivoting Process Chamber
Application:
09/907,485 →
Reactor for Processing a Workpiece Using Sonic Energy
Application:
09/907,552 →
Apparatus for Processing a Workpiece
Application:
09/907,522 →
Reactor for Processing a Workpiece Using Sonic Energy
Application:
09/907,524 →
Systems and Methods for Processing Workpieces
Application:
09/907,544 →
Systems and Methods for Processing Workpieces
Application:
09/907,487 →
Apparatus and Methods for Processing a Workpiece
Application:
09/907,484 →
Methods and Apparatus for Processing Microelectronic Workpieces Using Metrology
Application:
09/902,491 →
Processing Tools, Components of Processing Tools, and Method of Making and Using Same for Electrochemical Processing of Microelectronic Workpieces
Application:
09/882,293 →
Transfer Devices for Handling Microelectronic Workpieces Within an Environment of a Processing Machine and Methods of Manufacturing and Using Such Devices in the Processing of Microelectronic Workpieces
Application:
09/875,300 →
Method and Apparatus for Accessing Microelectronic Workpiece Containers
Application:
09/875,439 →