Methods for removing metallic contamination from wafer containers
View Patent ↗In a method for cleaning for cleaning metallic ion contamination, and especially copper, from wafer containers, the containers are loaded into a cleaning apparatus. The containers are sprayed with a dilute chelating agent solution. The chelating agent solution removes metallic contamination from the containers. The containers are then rinsed with a rinsing liquid, such as deionized water and a surfactant. The containers are then dried, preferably by applying heat and/or hot air movement.
1. A method for removing a metallic contamination a wafer container of the type used for holding wafers plated with metal, said method comprising the steps of:
spraying inside surfaces of the container with a solution of a liquid including a chelating agent;
rinsing the container; and
drying the container.
2. The method of claim 1 further including the step of spraying the inside surfaces of the container via spray nozzles oriented at different angles.
3. The method of claim 1 wherein the concentration of the chelating agent in the solution is 10-100 parts per million.
4. The method of claim 3 wherein the concentration of the chelating agent is 20-60 parts per million.
5. The method of claim 1 wherein the metal comprises copper.
6. The method of claim 1 wherein the solution comprises a chelating agent and de-ionized water.
7. The method of claim 1 further comprising the step of spraying the containers with a surfactant solution.
8. The method of claim 7 wherein the liquid includes the surfactant solution.
9. The method of claim 1 further comprising the step of irradiating the container with UV light to enhance the removal of the metallic contamination.
10. A method for removing a metal from a wafer container having inside and outside surfaces, said method comprising the steps of:
spraying the inside and outside surfaces of the container with a chelating agent solution comprising 1,2-Diaminocyclohexane-N,N,N 1 ,N 1 -tetraacetic acid monohydrate;
rinsing the container by spraying the inside and outside surfaces of the container with a rinsing solution including water; and
drying the container.
11. A method for removing a metal from a wafer container, said method comprising the steps of:
spraying inside surfaces of the container with a cleaning solution consisting essentially of water, a chelating agent, and a detergent or surfactant;
rinsing the container by spraying the inside surfaces with a rinsing solution including water; and
drying the container.
12. The method of claim 11 further including the step of spraying outside surfaces of the container with the cleaning solution and with the rinsing solution, via a plurality of spray nozzles oriented at different spray angles.
13. A method for removing a metallic contamination a wafer container of the type used for holding wafers plated with metal, said method comprising the steps of:
loading the container into a rotor;
spinning the rotor at a first speed;
spraying surfaces of the container spinning on the rotor with a solution of a liquid including a chelating agent;
rinsing the container; and
drying the container.
14. The method of claim 13 further comprising the step of spinning the rotor at a second speed that is faster than the first speed during the drying step.
15. The method of claim 13 wherein the concentration of the chelating agent in the solution is 20-60 parts per million.
16. A method for removing a metallic contamination from a wafer container of the type used for holding wafers plated with metal, said method comprising the steps of:
holding the container in a stationary position on a fixture;
spraying surfaces of the container with a solution of a liquid including a chelating agent;
rinsing the container; and
drying the container.