Patent Assignment
Reel/Frame 038355/0078
Security Interest
Recorded: 2016-04-05
Pages: 13
Assignor
OEM GROUP, LLC
Executed: 2016-03-16
Assignee
THL CORPORATE FINANCE, INC., AS COLLATERAL AGENT
100 FEDERAL STREET, 31ST FLOOR, BOSTON, MASSACHUSETTS, 02110
Covered Properties
(81)
Methods for Processing Semiconductors to Reduce Surface Particles
Patent:
5,489,557 →
Application:
08/391,724 →
Integrated Semiconductor Wafer Processing System
Patent:
5,672,239 →
Application:
08/438,261 →
Plasma Etch System
Patent:
5,985,089 →
Application:
08/450,369 →
Apparatus for, and Method of, Depositing a Film on a Substrate
Patent:
6,605,198 →
Application:
08/564,659 →
Apparatus for, and Method of, Removing Hydrocarbons from the Surface of a Substrate
Patent:
5,914,017 →
Application:
08/651,377 →
Plasma Etch Reactor and Method for Emerging Films
Patent:
6,048,435 →
Application:
08/675,093 →
Plasma Etch Reactor and Method
Patent:
6,500,314 →
Application:
08/675,559 →
Method and Apparatus for Etching a Semiconductor Wafer with Features Having Vertical Sidewalls
Patent:
6,127,277 →
Application:
08/742,861 →
Plasma Etch System
Patent:
5,958,139 →
Application:
08/850,224 →
Methods for Cleaning Semiconductor Surfaces
Patent:
6,240,933 →
Application:
08/853,649 →
Gas Intake Assembly for a Wafer Processing System
Patent:
6,105,592 →
Application:
08/897,913 →
Motor Drive Assembly for a Semiconductor Wafer Processing System
Patent:
6,098,641 →
Application:
08/897,914 →
A Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Patent:
6,046,116 →
Application:
08/974,089 →
Method for Developing an Enhanced Oxide Coating on a Component Formed from Stainless Steel or Nickel Alloy Steel
Patent:
5,985,048 →
Application:
09/056,287 →
Alkaline Water-Based Solution for Cleaning Metallized Microelectronic
Patent:
5,980,643 →
Application:
09/099,309 →
Cross Flow Centrifugal Processor
Patent:
6,062,239 →
Application:
09/108,162 →
Cleaning Apparatus
Method and Apparatus for Minimizing Semiconductor Wafer Arcing During Semiconductor Wafer Processing
Patent:
6,346,428 →
Application:
09/135,210 →
Plasma Etch Reactor Having a Plurality of Magnets (as Amended)
Patent:
6,354,240 →
Application:
09/152,238 →
Wafer Container Cleaning System
Patent:
6,322,633 →
Application:
09/362,157 →
Fluid Heating System for Processing Semiconductor Materials
Patent:
6,536,450 →
Application:
09/372,849 →
Ozone Conversion in Semiconductor Manufacturing
Patent:
6,408,535 →
Application:
09/384,077 →
Plasma Etch Reactor and Method for Emerging Films
Patent:
6,190,496 →
Application:
09/384,614 →
Plasma Etch System
Patent:
6,120,610 →
Application:
09/412,873 →
Vapor Assisted Rotary Drying Method and Apparatus
Patent:
6,199,298 →
Application:
09/413,622 →
A Non- Corrosive Cleaning Method for Use in the Manufacture of Microelectronic Devices
Patent:
6,312,527 →
Application:
09/436,613 →
Cobalt Silicide Etch Process and Apparatus
Patent:
6,486,069 →
Application:
09/454,814 →
Plasma Etch Reactor and Method
Patent:
6,620,335 →
Application:
09/455,641 →
Seal configuration for use with a motor drive assembly in a microelectronic workpiece processing system
Patent:
6,334,453 →
Application:
09/503,784 →
Method and Apparatus for Etching a Semiconductor Wafer with Features Having Vertical Sidewalls
Patent:
6,492,280 →
Application:
09/517,387 →
Method for Treating the Surface of a Workpiece
Patent:
6,701,941 →
Application:
09/536,251 →
Chemical Solutions System for Processing Semiconductor Materials
Patent:
6,446,644 →
Application:
09/609,879 →
Seal Configuration for Use W Ith a Motor Drive Assembly in a Microelectronic Work Piece Processing System
Patent:
6,408,863 →
Application:
09/610,175 →
Dual Cassette Centrifugal Processor
Patent:
6,418,945 →
Application:
09/611,537 →
Wafer Container Cleaning System
Patent:
6,412,502 →
Application:
09/611,642 →
Process and Apparatus for Treating a Workpiece Such as a Semiconductor Wafer
Patent:
6,869,487 →
Application:
09/621,028 →
Spray Nozzle System for a Semiconductor Wafer Container Cleaning Aparatus
Patent:
6,797,076 →
Application:
09/658,395 →
Apparatus and Method for Processing the Surface of a Workpiece Wih Ozone
Patent:
6,591,845 →
Application:
09/677,925 →
Apparatus and method for processing the surface of a workpiece with ozone
Patent:
6,273,108 →
Application:
09/677,929 →
Apparatus and method for processing the surface of a workpiece with ozone
Patent:
6,267,125 →
Application:
09/677,934 →
Solution for cleaning metallized microelectronic workpieces and methods of using same
Dual Degas/Cool Loadlock Cluster Tool
Methods for Cleaning Semiconductor Surfaces
System for, and Method of, Etching a Surface on a Wafer
Apparatus and Method for Delivering a Treatment Liquid and Ozone to Treat the Surface of a Workpiece
Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Reactor with Heated and Textured Electrodes and Surfaces
Process for Treating a Workpiece with Hydrofluoric Acid and Ozone
Methods for Processing a Workpiece Using Steam and Ozone
Method and Apparatus for Cleaning Containers
Processing a workpiece using ozone and sonic energy
Application:
10/051,860 →
Publication:
US 2002/0066464
Permanent Adherence of the Back End of a Wafer to an Electrical Component or Sub-Assembly
Wafer Container Cleaning System
Plasma Etch Reactor and Method
Dual Cassette Centrifugal Processor
Centrifugal Spray Processor and Retrofit Kit
Chemical Solutions Methods for Processing Semiconductor Materials
Wafer Container Cleaning System
Fluid Heating System for Processing Semiconductor Materials
Magnetron with Controlled Dc Power
Apparatus for Treating a Workpiece with Steam and Ozone
Method for Processing the Surface of a Workpiece
Reactive Sputtering of Silicon Nitride Films by Rf Supported Dc Magnetron
Methods of Thinning a Silicon Wafer Using Hf and Ozone
System for, and Method of, Etching a Surface on a Wafer
Methods for Cleaning Semiconductor Surfaces
Methods for Removing Metallic Contamination from Wafer Containers
Process and Apparatus for Treating a Workpiece Using Ozone
Process and Apparatus for Treating a Workpiece with Gases
Methods for Cleaning Wafer Containers
System and Method for Processing a Wafer Including Stop-on-Alumina Processing
Processing a Workpiece Using Water, a Base, and Ozone
Plasma Etch Reactor and Method
System and Methods for Polishing a Wafer
Apparatus and Method for Cleaning and Drying a Container for Semiconductor Workpieces
Dry Etch Stop Process for Eliminating Electrical Shorting in Mram Device Structures
High-adhesive backside metallization
Application:
11/863,046 →
Publication:
US 2008/0083611
Stress adjustment in reactive sputtering
Stress adjustment in reactive sputtering
Dry Etch Stop Process for Eliminating Electrical Shorting in Mram Device Structures
Sputter Deposition of Cermet Resistor Films with Low Temperature Coefficient of Resistance
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 9, 2013
From: APPLIED MATERIALS, INC.
To: OEM GROUP, INC.
Reel/Frame 031373/0540 →
Release of Security Interest
Nov 21, 2014
From: COMERICA BANK
To: OEM GROUP, INC.
Reel/Frame 034233/0481 →
Change of Name
Mar 14, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038083/0231 →
Change of Name
Mar 15, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038101/0574 →
Assignment of Assignor's Interest
Mar 15, 2016
From: APPLIED MATERIALS, INC.
To: OEM GROUP, INC.
Reel/Frame 037989/0332 →
Change of Name
Mar 21, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038179/0114 →
Change of Name
Mar 23, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038234/0250 →