Patent Assignment
Reel/Frame 034233/0481
Release of Security Interest
Recorded: 2014-11-21
Pages: 6
Assignor
COMERICA BANK
Executed: 2014-11-20
Assignee
OEM GROUP, INC.
2120 W. GUADALUPE, GILBERT, ARIZONA, 85233
Covered Properties
(37)
Integrated Semiconductor Wafer Processing System
Patent:
5,672,239 →
Application:
08/438,261 →
Plasma Etch System
Patent:
5,985,089 →
Application:
08/450,369 →
Apparatus for, and Method of, Depositing a Film on a Substrate
Patent:
6,605,198 →
Application:
08/564,659 →
Apparatus for, and Method of, Removing Hydrocarbons from the Surface of a Substrate
Patent:
5,914,017 →
Application:
08/651,377 →
Plasma Etch Reactor and Method for Emerging Films
Patent:
6,048,435 →
Application:
08/675,093 →
Plasma Etch Reactor and Method
Patent:
6,500,314 →
Application:
08/675,559 →
Method of Depositing Materials on a Wafer to Eliminate the Effect of Cracks in the Deposition
Patent:
6,086,947 →
Application:
08/729,015 →
Method and Apparatus for Etching a Semiconductor Wafer with Features Having Vertical Sidewalls
Patent:
6,127,277 →
Application:
08/742,861 →
Plasma Etch System
Patent:
5,958,139 →
Application:
08/850,224 →
A Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Patent:
6,046,116 →
Application:
08/974,089 →
Method and Apparatus for Minimizing Semiconductor Wafer Arcing During Semiconductor Wafer Processing
Patent:
6,346,428 →
Application:
09/135,210 →
Plasma Etch Reactor Having a Plurality of Magnets (as Amended)
Patent:
6,354,240 →
Application:
09/152,238 →
Plasma Etch Reactor and Method for Emerging Films
Patent:
6,190,496 →
Application:
09/384,614 →
Plasma Etch Reactor and Method for Emerging Films
Patent:
6,410,448 →
Application:
09/384,858 →
Plasma Etch System
Patent:
6,120,610 →
Application:
09/412,873 →
Cobalt Silicide Etch Process and Apparatus
Patent:
6,486,069 →
Application:
09/454,814 →
Plasma Etch Reactor and Method
Patent:
6,620,335 →
Application:
09/455,641 →
Method and Apparatus for Etching a Semiconductor Wafer with Features Having Vertical Sidewalls
Patent:
6,492,280 →
Application:
09/517,387 →
Dual degas/cool loadlock cluster tool
Patent:
6,235,656 →
Application:
09/609,733 →
Method and Apparatus for Minimizing Semiconductor Wafer Arcing During Semiconductor Wafer Processing
Patent:
6,406,925 →
Application:
09/712,707 →
Dual Degas/Cool Loadlock Cluster Tool
System for, and Method of, Etching a Surface on a Wafer
Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Reactor with Heated and Textured Electrodes and Surfaces
Flat Magnetron
Permanent Adherence of the Back End of a Wafer to an Electrical Component or Sub-Assembly
Plasma Etch Reactor and Method
Cluster Tool with a Hollow Cathode Array
Magnetron with Controlled Dc Power
Magnetron with adjustable target positioning
Application:
10/371,862 →
Publication:
US 2004/0163952
Reactive Sputtering of Silicon Nitride Films by Rf Supported Dc Magnetron
System for, and Method of, Etching a Surface on a Wafer
System and Method for Processing a Wafer Including Stop-on-Alumina Processing
Plasma Etch Reactor and Method
Dry Etch Stop Process for Eliminating Electrical Shorting in Mram Device Structures
Reactor with Heated and Textured Electrodes and Surfaces
Application:
12/203,022 →
Publication:
US 2008/0318432
Dry Etch Stop Process for Eliminating Electrical Shorting in Mram Device Structures
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Mar 14, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038083/0231 →
Change of Name
Mar 23, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038234/0250 →
Security Interest
Apr 5, 2016
From: OEM GROUP, LLC
To: THL CORPORATE FINANCE, INC., AS COLLATERAL AGENT
Reel/Frame 038355/0078 →