Patent Assignment
Reel/Frame 031373/0540
Assignment of Assignor's Interest
Recorded: 2013-10-09
Pages: 6
Assignor
APPLIED MATERIALS, INC.
Executed: 2013-09-25
Assignee
OEM GROUP, INC.
2120 W. GUADALUPE ROAD, GILBERT, ARIZONA, 85233
Covered Properties
(44)
Methods for Processing Semiconductors to Reduce Surface Particles
Patent:
5,489,557 →
Application:
08/391,724 →
Methods for Cleaning Semiconductor Surfaces
Patent:
6,240,933 →
Application:
08/853,649 →
Motor Drive Assembly for a Semiconductor Wafer Processing System
Patent:
6,098,641 →
Application:
08/897,914 →
Alkaline Water-Based Solution for Cleaning Metallized Microelectronic
Patent:
5,980,643 →
Application:
09/099,309 →
Cleaning Apparatus
Wafer Container Cleaning System
Patent:
6,322,633 →
Application:
09/362,157 →
Fluid Heating System for Processing Semiconductor Materials
Patent:
6,536,450 →
Application:
09/372,849 →
Vapor Assisted Rotary Drying Method and Apparatus
Patent:
6,199,298 →
Application:
09/413,622 →
A Non- Corrosive Cleaning Method for Use in the Manufacture of Microelectronic Devices
Patent:
6,312,527 →
Application:
09/436,613 →
Seal configuration for use with a motor drive assembly in a microelectronic workpiece processing system
Patent:
6,334,453 →
Application:
09/503,784 →
Method for Treating the Surface of a Workpiece
Patent:
6,701,941 →
Application:
09/536,251 →
Chemical Solutions System for Processing Semiconductor Materials
Patent:
6,446,644 →
Application:
09/609,879 →
Seal Configuration for Use W Ith a Motor Drive Assembly in a Microelectronic Work Piece Processing System
Patent:
6,408,863 →
Application:
09/610,175 →
Dual Cassette Centrifugal Processor
Patent:
6,418,945 →
Application:
09/611,537 →
Wafer Container Cleaning System
Patent:
6,412,502 →
Application:
09/611,642 →
Process and Apparatus for Treating a Workpiece Such as a Semiconductor Wafer
Patent:
6,869,487 →
Application:
09/621,028 →
Spray Nozzle System for a Semiconductor Wafer Container Cleaning Aparatus
Patent:
6,797,076 →
Application:
09/658,395 →
Apparatus and Method for Processing the Surface of a Workpiece Wih Ozone
Patent:
6,591,845 →
Application:
09/677,925 →
Apparatus and method for processing the surface of a workpiece with ozone
Patent:
6,273,108 →
Application:
09/677,929 →
Apparatus and method for processing the surface of a workpiece with ozone
Patent:
6,267,125 →
Application:
09/677,934 →
Solution for cleaning metallized microelectronic workpieces and methods of using same
Methods for Cleaning Semiconductor Surfaces
Apparatus and Method for Delivering a Treatment Liquid and Ozone to Treat the Surface of a Workpiece
Process for Treating a Workpiece with Hydrofluoric Acid and Ozone
Methods for Processing a Workpiece Using Steam and Ozone
Method and Apparatus for Cleaning Containers
Processing a workpiece using ozone and sonic energy
Application:
10/051,860 →
Publication:
US 2002/0066464
Wafer Container Cleaning System
Dual Cassette Centrifugal Processor
Centrifugal Spray Processor and Retrofit Kit
Chemical Solutions Methods for Processing Semiconductor Materials
Wafer Container Cleaning System
Fluid Heating System for Processing Semiconductor Materials
Apparatus for Treating a Workpiece with Steam and Ozone
Method for Processing the Surface of a Workpiece
Methods of Thinning a Silicon Wafer Using Hf and Ozone
Methods for Cleaning Semiconductor Surfaces
Methods for Removing Metallic Contamination from Wafer Containers
Process and Apparatus for Treating a Workpiece Using Ozone
Process and Apparatus for Treating a Workpiece with Gases
Methods for Cleaning Wafer Containers
Processing a Workpiece Using Water, a Base, and Ozone
System and Methods for Polishing a Wafer
Apparatus and Method for Cleaning and Drying a Container for Semiconductor Workpieces
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Mar 14, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038083/0231 →
Change of Name
Mar 21, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038179/0114 →
Security Interest
Apr 5, 2016
From: OEM GROUP, LLC
To: THL CORPORATE FINANCE, INC., AS COLLATERAL AGENT
Reel/Frame 038355/0078 →
Release of Security Interest
Dec 23, 2020
From: FIRST EAGLE ALTERNATIVE CAPITAL AGENT, INC.
To: OEM GROUP, LLC
Reel/Frame 054745/0456 →
Assignment of Assignor's Interest
Oct 1, 2021
From: OEM GROUP, LLC
To: OEMG HOLDINGS, LLC
Reel/Frame 057667/0607 →
Change of Name
Oct 1, 2021
From: OEM GROUP EAST, LLC
To: SHELLBACK SEMICONDUCTOR TECHNOLOGY, LLC
Reel/Frame 057684/0369 →
Assignment of Assignor's Interest
Oct 1, 2021
From: OEMG HOLDINGS, LLC
To: OEM GROUP EAST, LLC
Reel/Frame 057667/0895 →