IP Library › Patent Application 09999112
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App. No. 09/999,112 · Confirmation No. 5229

PROCESS FOR ETCHING THIN-FILM LAYERS OF A WORKPIECE USED TO FORM MICROELECTRONIC CIRCUITS OR COMPONENTS

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2003-10-09 IFEE Issue Fee Payment (PTO-85B) 1 View
2001-11-01 TRNA Transmittal of New Application 9 View
2001-11-01 A.PE Preliminary Amendment 3 View
2001-11-01 SPEC Specification 29 View
2001-11-01 CLM Claims 10 View
2001-11-01 ABST Abstract 1 View
2001-11-01 DRW Drawings-only black and white line drawings 10 View
2001-11-01 OATH Oath or Declaration filed 1 View
2001-11-01 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
App. No.
09/999,112
Filed
2001-11-01
Granted
2003-12-16
Pub. No.
US20030027430A1
Art Unit
1765
PTA
-225 days