Method and apparatus for controlling local current to achieve uniform plating thickness
View Patent ↗A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated. The process further includes impressing a current through the electroplating bath between the substrate and the anode, and between the second cathode and the anode, and electroplating the metallic features of different density onto the substrate.
1. A process for electroplating metallic features of different density on a surface of a substrate comprising:
providing an electroplating bath having an anode therein;
immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode;
positioning into the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface, a second cathode including a screening portion having openings of different sizes conforming to the metallic features to be electroplated, the second cathode screening portion having openings of larger size adjacent areas of higher density of features to be electroplated and having openings of smaller size adjacent areas of lower density of features to be electroplated; and
impressing a current through the electroplating bath between the substrate and the anode, and between the second cathode and the anode, and electroplating the metallic features of different density onto the surface of the substrate.
2. The process of claim 1 wherein the second cathode comprises a wire mesh.
3. The process of claim 1 wherein the second cathode screening portion comprises a wire mesh, the mesh having openings between the wires of larger size adjacent the areas of higher density of features to be electroplated and having openings between the wires of smaller size adjacent areas of lower density of features to be electroplated.
4. The process of claim 1 wherein the metallic features to be electroplated comprise metallic wires of different spacing, and the areas of higher density of features to be electroplated comprise metallic wires of closer spacing and the areas of lower density of features to be electroplated comprise metallic wires of larger spacing.
5. The process of claim 2 wherein the wire mesh is made of wire of about 0.001 to 0.05 in. diameter.
6. The process of claim 1 wherein the openings of larger size in the second cathode screening portion are of reduced size compared to adjacent areas of higher density of features to be electroplated.
7. A process for electroplating metallic features of different density on a surface of a substrate comprising:
determining density of features to be electroplated by obtaining a plan of features to be electroplated, defining different areas on the plan of features, and calculating fraction of area to be plated on the different areas on the plan of features;
providing an electroplating bath having an anode therein;
immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode;
positioning into the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface, a second cathode including a screening portion having openings of different sizes conforming to the metallic features to be electroplated, the second cathode screening portion having openings of larger size adjacent areas of higher density of features to be electroplated and having openings of smaller size adjacent areas of lower density of features to be electroplated; and
impressing a current through the electroplating bath between the substrate and the anode, and between the second cathode and the anode, and electroplating the metallic features of different density onto the surface of the substrate.
8. The process of claim 7 wherein the second cathode comprises a wire mesh.
9. The process of claim 7 wherein the second cathode screening portion comprises a wire mesh, the mesh having openings between the wires of larger size adjacent the areas of higher density of features to be electroplated and having openings between the wires of smaller size adjacent areas of lower density of features to be electroplated.
10. The process of claim 7 wherein the metallic features to be electroplated comprise metallic wires of different spacing, and the areas of higher density of features to be electroplated comprise metallic wires of closer spacing and the areas of lower density of features to be electroplated comprise metallic wires of larger spacing.
11. The process of claim 8 wherein the wire mesh is made of wire of about 0.001 to 0.05 in. diameter.
12. The process of claim 7 wherein the openings of larger size in the second cathode screening portion are of reduced size compared to adjacent areas of higher density of features electroplated.
13. The process of claim 7 further including constructing the second cathode by creating a mesh having openings of different sizes corresponding to the calculation of fraction of area to be plated on the different areas on the plan of features.