SRAM cell and method for fabricating the same
View Patent ↗SRAM cell and method for fabricating the same, the SRAM cell including a first local interconnection connected between first terminals of the first access transistor, the first load transistor, and the first drive transistor, and gates of the second load transistor, and the second drive transistor electrically, and a second local interconnection connected between first terminals of the second access transistor, the second load transistor, and the second drive transistor, and gates of the first load transistor, and the first drive transistor electrically, thereby reducing an area of the SRAM cell.
1. An SRAM cell having first and second access transistors, first and second drive transistors, and first and second load transistors on the same semiconductor substrate, comprising:
a first local interconnection connected between first terminals of the first access transistor, the first load transistor, and the first drive transistor, and gates of the second load transistor, and the second drive transistor, electrically;
a second local interconnection connected between first terminals of the second access transistor, the second load transistor, and the second drive transistor, and gates of the first load transistor, and the first drive transistor, electrically;
a first interlayer insulating film formed on an entire surface having first contact holes exposing parts of second terminals of the first and second access transistors, the first and second load transistors, and first and second drive transistors;
a first metal interconnection connected between second terminals of the first and second access transistors, first and second load transistors, and first and second drive transistors through the first contact holes, electrically;
a second interlayer insulating film formed over an entire surface of the semiconductor substrate, the second interlayer insulating film having second contact holes exposing parts of second terminals of the first and second access transistors and first and second drive transistors; and
a second metal interconnection connected to the second contact holes.
2. The SRAM cell as claimed in claim 1 , wherein the first or second local interconnection is formed of a metal with a low resistance.
3. The SRAM cell as claimed in claim 1 , wherein the first or second local interconnection is formed of TiN/Ti or copper.
4. The SRAM cell as claimed in claim 1 , wherein the first or second local interconnection has a thickness of approx. 300 Å.
5. The SRAM cell as claimed in claim 1 , wherein the first and second local interconnections are formed in symmetry.
6. The SRAM cell as claimed in claim 1 , wherein the conductive plug is formed of tungsten.
7. The An SRAM cell as claimed in claim 1 , wherein the metal interconnection is formed of aluminum or an alloy thereof.
8. The SRAM cell as claimed in claim 1 , wherein the second interlayer insulating film is formed of PE-TEOS.
9. The SRAM cell as claimed in claim 1 , wherein the interlayer insulating film has a thickness of 4000 Å.
10. The SRAM cell as claimed in claim 1 , wherein the metal interconnection is a metal film having a stack of Ti/Al/Ti/TiN films.
11. The SRAM cell as claimed in claim 1 , wherein the first, and second local interconnections have line/space of 0.20/0.19 μm.
12. The SRAM cell as claimed in claim 1 , wherein the contact hole has a width of 0.23 μm.
13. The SRAM cell as claimed in claim 1 , further comprising a barrier metal film formed on a surface of the contact hole.
14. The SRAM cell as claimed in claim 13 , wherein the barrier metal film includes a stack of Ti/TiN films.
15. An SRAM cell having first and second access transistors, first and second drive transistors, and first and second load transistors on the same semiconductor substrate, comprising:
a first interlayer insulating film formed over an entire surface thereof having first contact holes to expose parts of a first terminal of the second access transistor, the second load transistor, and the second drive transistor, parts of gates of the first load transistor and the first drive transistor, and parts of second terminals of the first and second access transistors, first and second load transistors, and first and second drive transistors;
a first conductive plug inside of the first contact hole with a first barrier metal film disposed inbetween;
a local interconnection on the first conductive plug and the first interlayer insulating film adjacent to the first conductive plug;
a second interlayer insulating film formed over an entire surface having second contact holes to expose parts of second terminals of the first and second access transistors, first and second load transistors, and first and second drive transistors;
a second conductive plug formed inside of the second contact hole with a barrier metal film disposed inbetween; and
a metal interconnection on the second conductive plugs and the second interlayer insulating film adjacent to the second conductive plug,
wherein the local interconnection has a thickness of approx. 300 Å.
16. The SRAM cell as claimed in claim 15 , wherein the second interlayer insulating film is formed of PE-TEOS.
17. The SRAM cell as claimed in claim 15 , wherein the local interconnections have line/space of 0.20/0.19 μm.
18. The SRAM cell as claimed in claim 15 , wherein the first, or second contact hole has a width of 0.23 μm.
19. An SRAM cell having first and second access transistors, first and second drive transistors, and first and second load transistors on the same semiconductor substrate, comprising:
a first local interconnection connected between first terminals of the first access transistor, the first load transistor, and the first drive transistor, and gates of the second load transistor, and the second drive transistor, electrically;
a second local interconnection connected between first terminals of the second access transistor, the second load transistor, and the second drive transistor, and gates of the first load transistor, and the first drive transistor, electrically;
an interlayer insulating film formed over an entire surface having contact holes exposing parts of second terminals of the first and second access transistors, the first and second load transistors, and first and second drive transistors; and
a metal interconnection connected between second terminals of the first and second access transistors, first and second load transistors, and first and second drive transistors through the contact holes, electrically,
wherein the first or second interconnection has a thickness of approximately 300 Å.
20. The SRAM cell as claimed in claim 19 , wherein the first and second local interconnections have line/space of 0.20/0.19 μm.
21. The SRAM cell as claimed in claim 19 , wherein the contact hole has a width of 0.23 μm.