Device for sticking protective sheet on substrate surface
View Patent ↗The device for sticking a protective sheet on the substrate surface according to the present invention comprises a sticking unit for sticking a surface protective sheet on a semiconductor wafer, and a thermocompression and cutting unit which conducts thermocompression bonding for the periphery of the semiconductor wafer and cuts the surface protective sheet along the edge of the semiconductor wafer.
1. A device for sticking a surface protective sheet on a surface of a semiconductor wafer comprising:
a sticking unit for sticking said surface protective sheet on said semiconductor wafer; and
a thermocompression and cutting unit which conducts thermocompression bonding along a peripheral surface of said protective sheet except for a central surface of said protective sheet and cuts said surface protective sheet along the edge of said semiconductor wafer, wherein,
the portion which conducts the thermocompression bonding of said heat pressing and cutting unit is formed of a metallic body equipped with a heater, and
said metallic body is of a roller shape.
2. The device for sticking a protective sheet on the substrate surface as claimed in claim 1 , wherein the surface of said metallic body to be brought into contact with said surface protective sheet is formed flat and smooth.
3. The device for sticking a protective sheet on the substrate surface as claimed in claim 1 , wherein said metallic body is formed of a material containing copper or stainless steel.
4. The device as claimed in claim 1 , wherein said surface protective sheet has a base material layer and an adhesive layer, said adhesive layer having a lower softening point than that of said base material layer.