IP Library Granted Patent US 7,065,117
Granted Patent B2
US 7,065,117 · App. 10/322,599 · Granted Jun 20, 2006

Semiconductor laser element having end-facet protection layer which includes unoxidized or unnitrided first sublayer formed on end facet and second sublayer produced by oxidizing or nitriding the surface of the first sublayer

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Quick Facts
Patent No.
US 7,065,117
App. No.
10/322,599
Granted
Jun 20, 2006
Kind
B2
Abstract

A semiconductor laser element includes: a stack of layers having resonator facets; and at least one protection layer formed on at least one of the resonator facets. Each of the at least one protection layer includes at least first, second, and third sublayers. The first sublayer is formed nearest to the stack among the at least first, second, and third sublayers, and made of a material not containing oxygen (or nitrogen) as a constituent element. The second sublayer is made of an oxide (or nitride) produced by oxidizing (or nitriding) a portion of the first sublayer. The third sublayer is formed farthest from the stack among the at least first, second, and third sublayers, and made of an oxide (or nitride). The thickness d 2 of the second sublayer and the total thickness d 1 of the first and second sublayers satisfy a relationship, 0.1≦d 2 /d 1 ≦0.9.

Claims (12)

1. A semiconductor laser element comprising:

a stack of a plurality of layers having cleaved faces which are perpendicular to a light propagation direction and function as resonator faces; and

at least one protection layer formed on at least one of said cleaved faces;

wherein each of said at least one protection layer includes at least first, second, and third sublayers,

said first sublayer is formed nearest to said stack among said at least first, second, and third sublayers, and made of a material which does not contain oxygen as a constituent element,

said second sublayer which is made of a material comprising an oxide produced by oxidizing a portion of said first sublayer, and has a thickness d 2 ,

said third sublayer is formed farthest from said stack among said at least first, second, and third sublayers, and made of a material comprising an oxide,

said first and second sublayers have a total thickness d 1 , and

said total thickness d 1 and said thickness d 2 of said second sublayer satisfy a relationship, 0.1≦d 2 /d 1 ≦0.9.

2. A semiconductor laser element according to claim 1 , wherein said first sublayer is made of at least one of Al, Ga, Si, Ge, Ta, and Ti.

3. A semiconductor laser element according to claim 1 , wherein said third sublayer is made of a material comprising an oxide of at least one of Al, Ga, Si, Ge, Ta, and Ti, and the material of which said third sublayer is made is different from the material of which said second sublayer is made.

4. A semiconductor laser element according to claim 2 , wherein said third sublayer is made of a material comprising an oxide of at least one of Al, Ga, Si, Ge, Ta, and Ti, and the material of which said third sublayer is made is different from the material of which said first sublayer is made.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2012
From: FUJIFILM CORPORATION
To: NICHIA CORPORATION
Reel/Frame 028094/0493 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2007
From: FUJIFILM HOLDINGS CORPORATION (FORMERLY FUJI PHOTO FILM CO., LTD.)
To: FUJIFILM CORPORATION
Reel/Frame 018904/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2002
From: YAMANAKA, FUSAO
To: FUJI PHOTO FILM CO., LTD.
Reel/Frame 013593/0252 →